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Vapor chamber manufacturing method

A manufacturing method and steam chamber technology, applied in lighting and heating equipment, indirect heat exchangers, heat exchange equipment, etc., can solve the problems of reduced grain boundary corrosion resistance, solder wetting and expansion hindrance, grain boundary cracks, etc., to achieve Effects of suppressing reduction in heat transfer performance, suppressing coarsening, and improving leak resistance and corrosion resistance

Inactive Publication Date: 2018-11-23
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the wetting and spreading of the solder is hindered, or the fatigue phenomenon caused by repeated internal pressure fluctuations (stress is added to the frame) due to evaporation and condensation during use of the steam chamber causes grain boundary cracks to occur. The results indicated that leakage occurred, or corrosion resistance decreased at grain boundaries

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Copper alloys shown in Table 1 were cast, and copper alloy strips with a thickness of 0.40 mm were produced by the production methods described above. In Table 1, No. 1 and 2 are Cu-Fe-P systems, No. 3 to 5 are Cu-(Ni, Co)-Si systems, and No. 6 is Cu-(Ni, Co)-P systems. No. 7 is a Cu-Cr system, No. 8 is a Cu-Cr-Zr system, and No. 9 is a conventional OFC (Oxygen-Free Copper).

[0114] With the manufactured copper alloy strips as test materials, the 0.2% yield strength, elongation and electrical conductivity were measured according to the following methods.

[0115] The plate extracted from each produced copper alloy strip was water-cooled after heating at 850° C. for 30 minutes in a bonding step corresponding to a steam chamber. Take the water-cooled board as the test material, and measure the 0.2% yield strength and electrical conductivity in the same way.

[0116] In addition, for the plate extracted from each copper alloy strip produced, water cooling after heating ...

Embodiment 2

[0131] Copper alloys having the compositions shown in Nos. 1, 3, 6, and 9 of Table 1 were cast, and copper alloy strips with a thickness of 1.0 mm were produced by the production methods described above. Take the manufactured copper alloy strip as the test material, and measure the 0.2% yield strength at high temperature according to the following method. The results are shown in Table 3. Note that Nos. 1A, 3A, 6A, and 9A in Table 3 mean copper alloy strips having a plate thickness of 1.0 mm and alloy compositions corresponding to those of Nos. 1, 3, 6, and 9 in Table 1, respectively.

[0132] (measurement of 0.2% yield strength at high temperature)

[0133] Cut out the JIS No. 5 tensile test piece from the test material so that the longitudinal direction is parallel to the rolling direction, hold it at each temperature shown in Table 3 for 30 minutes, and then pull it at the same temperature according to the provisions of JISZ2241. Tensile test, measuring 0.2% yield strengt...

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Abstract

A method of manufacturing a vapor chamber in which, after assembling the vapor chamber with a plurality of components, the components are joined together by a process of heating to 650 DEG C or higher, wherein components 2, 3 from among the components and constituting a case for the vapor chamber are made from a precipitation hardened copper alloy, and the precipitation hardened copper alloy is age-processed and precipitation hardened without deformation processing of the vapor chamber case after joining.

Description

technical field [0001] The present invention relates to a method of manufacturing a vapor chamber (a flat heat pipe) by joining a plurality of parts. Background technique [0002] The speed and density of CPUs mounted on desktop PCs, notebook PCs, tablet terminals, and mobile phones represented by smartphones are rapidly increasing, and the heat dissipation per unit area of ​​these CPUs is further increasing. If the temperature of the CPU rises to a certain level of high temperature, it will cause misoperation, thermal runaway, etc., and therefore, effective heat dissipation from semiconductor devices such as the CPU becomes a real problem. [0003] A heat sink can be used as a heat dissipation part that absorbs heat from a semiconductor device and dissipates it into the atmosphere. Since high thermal conductivity is required for the heat sink, copper, aluminum, or the like having high thermal conductivity is used as a material. The method used in the desktop PC is to tran...

Claims

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Application Information

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IPC IPC(8): F28D15/02
CPCF28D15/02F28D15/0283F28F21/085
Inventor 桥本大辅西村昌泰
Owner KOBE STEEL LTD