Resin composition and adhesive film and cover film made thereof
A technology of resin composition and epoxy resin, applied in the direction of film/sheet without carrier, adhesive, adhesive additive, etc., can solve the problem of low thermal decomposition temperature, low glass transition temperature, and difficulty in applying flexible printed circuit boards and other problems, to achieve the effect of high thermal decomposition temperature, excellent flame retardancy, high temperature resistance and high reliability
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Embodiment 1
[0057] A total of 100 parts of the resin composition includes: 30 parts of polyamide-imide resin (TOYOBO, HR-71DD), 40 parts of biphenyl epoxy resin (Nippon Kayaku, NC3000H), active polyethersulfone (SOLVAY, 3600RP , its molecular weight is about 7000, hydroxyl content 170 μ eq / g) 20 parts, phosphorus-containing phenolic (SHINA chemical, LC-950, its hydroxyl equivalent is 345 g / eq, phosphorus content is 9.2%) 10 parts. Add 0.03 parts of imidazole accelerator and DMAC solvent to the composition to make a glue solution, stir and mix evenly, coat it on a release film or polyimide film, and bake it in an oven at 155 degrees for 5 minutes to remove The solvent yields an adhesive film or cover film product. The detection performance is shown in Table 1.
Embodiment 2
[0059] A total of 100 parts of the resin composition includes: 50 parts of polyamide-imide resin (TOYOBO, HR-71DD), 20 parts of novolac epoxy resin (HEXION, EPR627), active polyethersulfone (SOLVAY, 3000RP, its molecular weight is about 20000, hydroxyl content 50 μeq / g) 15 parts, phosphorus-containing phenolic (Dow Chemical, XZ92741, its hydroxyl equivalent is 340 g / eq, phosphorus content is 9.4%) 15 parts. Add 0.02 parts of imidazole accelerator and DMAC solvent to the composition to make a glue solution, stir and mix evenly, coat it on a release film or polyimide film, and bake it in an oven at 155 degrees for 5 minutes to remove The solvent yields an adhesive film or cover film product. The detection performance is shown in Table 1.
Embodiment 3
[0061] A total of 100 parts of the resin composition includes: polyamide-imide resin (SOLVAY, AI-10) 60 parts, phosphorus-containing epoxy resin (Dow Chemical, XZ92530, its epoxy equivalent is 325g / eq, and the phosphorus content is 3%) 30 parts, active polyethersulfone (SOLVAY, 3600RP, its molecular weight is about 7000, hydroxyl content 170μeq / g) 5 parts, phosphorus-containing phenolic (SHINA chemical, LC-950, its hydroxyl equivalent is 345g / eq, phosphorus content 9.2%) 5 parts. Add 0.03 parts of imidazole accelerator and DMAC solvent to the composition to make a glue solution, stir and mix evenly, coat it on a release film or polyimide film, and bake it in an oven at 155 degrees for 5 minutes to remove The solvent yields an adhesive film or cover film product. The detection performance is shown in Table 1.
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