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Gold alloy bonding wire and manufacturing method thereof

A technology of alloy bonding and bonding wire, which is applied in the field of bonding wire, can solve the problems of high bondability and reliability, low tensile strength of gold bonding wire, and unfavorable enterprises to improve their competitiveness, so as to improve the anti-vulcanization ability , Excellent anti-vulcanization performance, excellent high reliability performance

Active Publication Date: 2018-11-30
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the international gold price continues to rise, the price of gold bonding wire has also risen all the way, resulting in high cost of end products, which is not conducive to enterprises to improve their competitiveness
In addition, the tensile strength of gold bonding wire is low (for example, the maximum tensile strength of gold bonding wire with a diameter of 20 microns is less than 5 gf after welding), and the elongation is not easy to control
[0005] In order to reduce costs, various bonding wires, such as silver alloy wires, gold alloy wires, and gold-plated silver alloy bonding wires, are emerging, and their prices are relatively low, which can also meet the different needs of different customers; but for high-end LEDs have high requirements on the jointability and reliability of products. Due to the oxidation of silver, conventional silver alloys and gold-plated silver alloy wires will have defects such as bonding oxidation, silver ion potential migration, and poor eutectic solder joints. In terms of sexuality, it does not meet the requirements of customers

Method used

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  • Gold alloy bonding wire and manufacturing method thereof
  • Gold alloy bonding wire and manufacturing method thereof

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Effect test

Embodiment 1

[0026] The gold alloy bonding wire of this embodiment contains 1.0% by weight of Pd, 30% of Ag, 0.5% of Cu, 1% of Pt, 80ppm of Ce, 20ppm of Ca, and the balance is gold.

[0027] In this embodiment, the manufacturing method of gold alloy bonding wire comprises the following steps:

[0028] (1) Melting and casting: Pd, Ag, Cu, Pt, Ce and Ca are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0029] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a bonded wire semi-finished product with a diameter of 0.5mm;

[0030] (3) Continue to draw the semi-finished bonding wire obtained in step (2) to obtain a gold alloy bonding wire with a diameter of 15-50 um (such as 20 um);

[0031] During the wire drawing process, intermediate annealing is carried out several times on the semi-finished product of the bonding wire. During the annealing process, N 2...

Embodiment 2

[0036] The gold alloy bonding wire of this embodiment contains 1.5% by weight of Pd, 20% of Ag, 0.6% of Cu, 2% of Pt, 80ppm of Ca, and the balance is gold.

[0037] In this embodiment, the manufacturing method of gold alloy bonding wire comprises the following steps:

[0038] (1) Melting and casting: Pd, Ag, Cu, Pt and Ca are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0039] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a bonded wire semi-finished product with a diameter of 0.2mm;

[0040](3) Continue to draw the semi-finished bonding wire obtained in step (2) to obtain a gold alloy bonding wire with a diameter of 15-50 um (such as 20 um);

[0041] During the wire drawing process, intermediate annealing is carried out several times on the semi-finished product of the bonding wire. During the annealing process, N 2 As the annealing ...

Embodiment 3

[0046] The gold alloy bonding wire of this embodiment contains 2% by weight of Pd, 15% of Ag, 1% of Cu, 0.2% of Pt, 100ppm of Ni, and the balance is gold.

[0047] In this embodiment, the manufacturing method of gold alloy bonding wire comprises the following steps:

[0048] (1) Melting and casting: Pd, Ag, Cu, Pt and Ni are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0049] (2) Wire drawing: drawing the wire obtained in step (1) to obtain a semi-finished bonding wire with a diameter of 0.08mm;

[0050] (3) Continue to draw the semi-finished bonding wire obtained in step (2) to obtain a gold alloy bonding wire with a diameter of 15-50 um (such as 20 um);

[0051] During the wire drawing process, intermediate annealing is carried out several times on the semi-finished product of the bonding wire. During the annealing process, N 2 As the annealing atmosphere...

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Abstract

The invention provides a gold alloy bonding wire and further provides a manufacturing method of the gold alloy bonding wire. The gold alloy bonding wire is characterized in that the gold alloy bondingwire comprises, by weight, 0.5-2% of Pd, 15-30% of Ag, 0.5-3% of Cu, 0.1-2% of Pt, 2-200 ppm of a minor additive element and the balance gold, wherein the minor additive element is one or two or moreof Ca, In, Co, Be, Ga, Mg, Ce and Ni. The gold alloy bonding wire has excellent high reliability and sulfidation resistance, high tensile strength and good welding spot connectivity, and can lower the cost.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a gold alloy bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Another important direction is the development of gold alloy wires to further reduce costs and mainta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48B21C37/04C22C5/02C22F1/02C22F1/14
CPCH01L24/43H01L24/45C22C5/02C22F1/02C22F1/14B21C37/047H01L2224/45157H01L2224/45155H01L2224/45147H01L2224/45164H01L2224/45144H01L2224/45139H01L2224/45169H01L2224/45109H01L2224/45105H01L2224/45123H01L2924/01029H01L2924/01031H01L2924/01046H01L2924/01047H01L2924/01049H01L2924/01058H01L2924/01079H01L2924/01078H01L2924/013H01L2924/01012H01L2924/01004H01L2924/0102H01L2924/01027H01L2924/01028H01L2224/43848
Inventor 周振基周博轩于锋波彭政展麦宏全
Owner NICHE TECH KAISER SHANTOU
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