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Additive for manufacturing 5-micron high-tensile copper foil and technology

An additive and high-strength technology, applied in the electrolytic process, electroforming, etc., can solve the problems of high production cost of electrolytic copper foil, poor coating thickness uniformity, coarse and loose crystal structure, etc., and achieve low double-sided roughness and short reaction time Short, good thickness uniformity

Active Publication Date: 2018-12-11
惠州联合铜箔电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Because the inorganic additives containing arsenic and antimony are harmful to human body and environment, and the price of such metals is high, the production cost of electrolytic copper foil is high.
Among the currently used organic additives, the prepared copper foil has the problems of poor uniformity of coating thickness, coarse and loose crystal structure and low tensile strength, and the existing technology can only achieve 10 microns or less, which is not very good. Fully meet the application of high-end circuit boards and large-capacity lithium batteries

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] An additive for manufacturing 5-micron high-tensile copper foil, specifically adding to 1 L copper sulfate electrolyte: gelatin 400 mg, hydroxyethyl cellulose 100 mg, polyethylene glycol 100 mg, sodium chloride 200 mg, phenyl poly 30 mg of sodium dithiopropane sulfonate, and 30 mg of polyoxyethylene polyoxypropylene block compound.

[0034] Before adding copper sulfate electrolyte, hydroxyethyl cellulose and polyethylene glycol are mixed aqueous solutions with a mass ratio of 1:1. Before adding the copper sulfate electrolyte, the sodium phenyl polydithiopropane sulfonate and the polyoxyethylene polyoxypropylene block compound are a mixed solution with a mass ratio of 1:1. In copper sulfate electrolyte, Cu 2+ Concentration is 100g / L, H 2 SO 4 The concentration was 110 g / L; the temperature of the electrolyte was controlled at 50 °C. The flow of additives was controlled at 40 mL / min.

[0035] Using the above additive to manufacture 5 micron high tensile copper foil, t...

Embodiment 2

[0041] An additive for the manufacture of 5-micron high-tensile copper foil, specifically adding: 100 mg of gelatin, 50 mg of hydroxyethyl cellulose, 50 mg of polyethylene glycol, 70 mg of sodium chloride, and phenylpolyethylene per 1 L of copper sulfate electrolyte Sodium dithiopropane sulfonate 10 mg, polyoxyethylene polyoxypropylene block compound 10 mg.

[0042] Before adding the copper sulfate electrolyte, hydroxyethyl cellulose and polyethylene glycol are a mixed aqueous solution with a mass ratio of 1:1. Before adding the copper sulfate electrolyte, the sodium phenyl polydithiopropane sulfonate and the polyoxyethylene polyoxypropylene block compound are a mixed solution with a mass ratio of 1:1. In copper sulfate electrolyte, Cu 2+ Concentration is 90g / L, H 2 SO 4 The concentration is 100g / L; the temperature of the electrolyte is controlled at 45°C. The flow rate of the additive is controlled at 40mL / min.

[0043] Using the above-mentioned additives to produce 5 mi...

Embodiment 3

[0049] An additive for the manufacture of 5-micron high-tensile copper foil, specifically adding: 600 mg of gelatin, 300 mg of hydroxyethyl cellulose, 300 mg of polyethylene glycol, 300 mg of sodium chloride, and phenyl poly Sodium dithiopropane sulfonate 50 mg, polyoxyethylene polyoxypropylene block compound 50 mg.

[0050] Before adding the copper sulfate electrolyte, hydroxyethyl cellulose and polyethylene glycol are a mixed aqueous solution with a mass ratio of 1:1. Before adding the copper sulfate electrolyte, the sodium phenyl polydithiopropane sulfonate and the polyoxyethylene polyoxypropylene block compound are a mixed solution with a mass ratio of 1:1. In copper sulfate electrolyte, Cu 2+ Concentration is 105g / L, H 2 SO 4 The concentration is 110g / L; the temperature of the electrolyte is controlled at 50°C. The flow rate of the additive is controlled at 40mL / min.

[0051] Using the above-mentioned additives to produce 5 micron high-tensile copper foil, the specif...

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Abstract

The invention provides an additive for manufacturing 5-micron high-tensile copper foil. According to the additive, 100-600 mg of gelatin, 50-300 mg of hydroxyethyl cellulose, 50-300 mg of polyethyleneglycol, 50-500 mg of sodium chloride, 10-50 mg of 3,3'-dithiobis-1-propanesulfonic acid disodium salt and 10-50 mg of polyox-yethylene-polyoxypropylene block compound are added into each 1 L of copper sulfate electrolyte. The additive for manufacturing the 5-micron high-tensile copper foil is an organic additive, the components are optimized, so that when the additive is applied in the productionprocess of the copper foil, the thickness uniformity of the manufactured electrolytic copper foil is good, and high elongation rate and high tensile strength are achieved. The invention further provides a technology for producing the 5-micron high-tensile copper foil by adopting the additive.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil manufacturing, in particular to an additive and a process for manufacturing 5-micron high tensile copper foil. Background technique [0002] As the electronic basic material of printed circuit board PCB and lithium battery anode material, the tensile strength, elongation, compactness, surface roughness, thickness uniformity and appearance quality of electrolytic copper foil will affect the electrochemical performance of electronic products. In the production process of electrolytic copper foil, additives have a great influence on its morphology and structure. [0003] The additives currently used in the production of electrolytic copper foil include: inorganic additives, such as inorganic additives containing arsenic and antimony, which are used to increase cathodic polarization and inhibit abnormal metal growth to improve the elasticity, strength, hardness and smoothness of coppe...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/04C25D3/38
Inventor 周启伦
Owner 惠州联合铜箔电子材料有限公司
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