Electronic device and its circuit substrate

Abstract

The invention discloses an electronic device and its circuit substrate. The electronic device is used for working with an electronic package element. The electronic package element has a predetermined contact pad array, the contact pad array includes a plurality of first contact pads, and the electronic device includes a circuit substrate and a main control element disposed on the circuit substrate. The circuit substrate includes a plurality of conductive pillars penetrating the circuit substrate. The plurality of conductive pillars include a plurality of first conductive pillars arranged corresponding to the positions of the first contact pads. The main control element and the electronic packaging element are respectively arranged on two opposite sides of the circuit substrate, and the electronic packaging element overlaps the main control element in the thickness direction of the circuit substrate. The main control element includes a signal contact array, the signal contact array includes a plurality of first signal contacts, and the first signal contacts are electrically connected to the corresponding first contact pads through the corresponding first conductive columns. In this way, the circuit design of the circuit substrate can be simplified, so as to reduce the crosstalk caused by too many or too dense wiring.

Description

technical field [0001] The invention relates to an electronic device and its circuit substrate, in particular to an electronic device and its circuit substrate for simplifying circuit complexity. Background technique [0002] Existing electronic devices generally include a circuit board, an integrated circuit component disposed on the circuit board, and at least one electronic component. In existing electronic devices, integrated circuit components and electronic components are assembled on the same side of a circuit board and are electrically connected through multiple circuit layers on the circuit board. [0003] Currently, electrical contacts of some electronic components, such as DRAM (Dynamic Random Access Memory, DRAM), have predetermined specifications. The electrical contacts of the integrated circuit components and the wiring of the circuit board must be designed corresponding to the electrical contacts of the predetermined electronic components. As the requiremen...

AI Technical Summary

Problems solved by technology

In addition, as the volume of electronic devices gradually shrinks, the electrical contacts of integrated circuit components and the circuit layout of circuit boards become denser and more complex in order to cooperate with various electronic components.

[0004] However, the higher the circuit density and complexity on the circuit board, the more susceptible it is to electromagnetic interference or crosstalk when the electronic device is operating.

In addition, if the line connected to the integrated circuit and electronic components is too long, it will also increase the loss of electrical signal transmission.

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