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Reactive flame retardant for epoxy resin and its flame retardant epoxy resin

A reactive flame retardant, epoxy resin technology, applied in the field of materials, can solve the problems of reducing the transparency and refractive index of epoxy resin, deterioration of material physical and mechanical properties, reducing the mechanical properties of resin matrix, etc., so as to improve light extraction. Efficiency, good physical and mechanical properties, the effect of reducing the risk of fire accidents

Active Publication Date: 2020-12-01
SHENZHEN POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most organophosphorus flame retardants are additive flame retardants, which have the disadvantages of poor compatibility with the resin matrix, easy oozing, large addition amount, and reduced mechanical properties of the resin matrix, resulting in deterioration of the physical and mechanical properties of the material; and Adding most phosphorus-containing flame retardants to epoxy resin will reduce the transparency and refractive index of epoxy resin; phosphorus is easy to dissolve after the final product is discarded, causing pollution to the environment, etc.

Method used

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  • Reactive flame retardant for epoxy resin and its flame retardant epoxy resin
  • Reactive flame retardant for epoxy resin and its flame retardant epoxy resin
  • Reactive flame retardant for epoxy resin and its flame retardant epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A kind of epoxy resin composition, it comprises epoxy resin E55, m-xylylenediamine and DOPO-AM, the weight percent of above-mentioned three is: 82%, 13%, 5%; Above-mentioned substance obtains cured product through curing reaction , the specific formula and performance test results are shown in Table 1.

Embodiment 2

[0046] An epoxy resin composition, which includes epoxy resin E55, m-xylylenediamine and DOPO-AM, the weight percentages of the above three are: 80%, 10%, and 10%; the above-mentioned substances are cured by curing reaction , the specific formula and performance test results are shown in Table 1.

Embodiment 3

[0050] An epoxy resin composition, which includes epoxy resin E55, m-xylylenediamine and DOPO-AM, the weight percentages of the above three are: 75%, 10%, and 15%; the above-mentioned substances are cured by curing reaction , the specific formula and performance test results are shown in Table 1.

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Abstract

The invention provides a reactive flame retardant for epoxy resin and flame retardant epoxy resin of the reactive flame retardant, wherein the reactive flame retardant for epoxy resin comprises at least one of DOPO-AM, DOPO-Urea and DOPO-THU. DOPO is subjected to a reaction with acrylamide, urea and thiourea, and the obtained DOPO-AM, DOPO-Urea and DOPO-THU are reactive organo-phosphorus flame retardants, all of which contain an amine group. When the reactive flame retardants are added into epoxy resin, the amine groups can react with epoxy resin, so as to graft the flame retardants onto a main chain of epoxy resin, so that the migration problem of additive flame retardants is solved; the flame retardant has very good flame retardant properties, and has relatively less effect on the mechanical properties and other properties of epoxy resin, so that epoxy resin also maintains good physical and mechanical properties; moreover, the flame retardant can also improve the refractive index ofepoxy resin.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a reactive flame retardant for epoxy resin and a flame retardant epoxy resin thereof. Background technique [0002] The potting process refers to an operation process that reasonably arranges, assembles, connects, seals and protects the components that make up the electronic components by means of potting materials. It mainly prevents moisture, dust and harmful gases from damaging the electronic components. The intrusion of devices enables electronic components to achieve the purpose of slowing down vibration, preventing external force damage and stabilizing parameters. There are many types of potting materials (usually referring to potting glue) for electronic components, mainly including EP (epoxy resin) potting glue, silicone potting glue and PU (polyurethane) potting glue. Among them, epoxy potting adhesive has excellent mechanical properties, electrical insula...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/5313
CPCC08K5/5313C08L2201/02C08L63/00
Inventor 罗超云左建东南创
Owner SHENZHEN POLYTECHNIC
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