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Method for achieving classified recovery of metals in circuit boards

A technology for circuit boards and metals, which is applied in the field of classified recycling of metals in circuit boards, to achieve the effects of improving efficiency and product purity, improving separation effects, and avoiding operational hazards

Inactive Publication Date: 2018-12-14
BOMIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, it overcomes the disadvantages that noble metals enter the solution in the form of ions, and need to use strong reducing agents for chemical extraction again.

Method used

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  • Method for achieving classified recovery of metals in circuit boards
  • Method for achieving classified recovery of metals in circuit boards
  • Method for achieving classified recovery of metals in circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A method for sorting and recycling metals in circuit boards, comprising the following steps:

[0049] S1. Use a pulverizer to pulverize the circuit board and pass it through a 25-mesh screen;

[0050] S2. Add 20L 1mol / L dilute hydrochloric acid to the pulverized particles to react the active metal with the acid to elute, filter and separate to obtain the filtrate and filter residue, and reclaim the salt solution containing the active metal from the filtrate;

[0051] S3. Add the filter residue to the above-mentioned anode rotary mortar electrolysis device, electrolytically dissolve the copper particles on the substrate in the electrolyte, and make the precious metal deposited on the copper surface detach from the substrate, and at the same time recover the refined copper at the cathode;

[0052] S4. Transfer the precious metal and resin in the anode tank to CCl 4 In the flotation agent, the difference in density is used to precipitate the precious metal, the resin floa...

Embodiment 2

[0076] A method for sorting and recycling metals in circuit boards, comprising the following steps:

[0077] S1. Use a pulverizer to pulverize the circuit board and pass through a 100-mesh screen;

[0078] S2. Add 10L 3mol / L dilute sulfuric acid to the pulverized particles to dissolve the active metal and the acid, filter and separate to obtain the filtrate and filter residue, and reclaim the salt solution containing the active metal from the filtrate;

[0079] S3. Add the filter residue to the above-mentioned anode rotary mortar electrolysis device, electrolytically dissolve the copper particles on the substrate in the electrolyte, and make the precious metal deposited on the copper surface detach from the substrate, and at the same time recover the refined copper at the cathode;

[0080] S4. Transfer the precious metal and resin in the anode tank to CCl 4 In the flotation agent, the difference in density is used to precipitate the precious metal, the resin floats on the sol...

Embodiment 3

[0088] A method for sorting and recycling metals in circuit boards, comprising the following steps:

[0089] S1. Use a pulverizer to crush the circuit board and pass it through a 65-mesh screen;

[0090] S2. Add 18L 1.5mol / L dilute hydrochloric acid to the pulverized particles to react the active metal with the acid to elute, filter and separate to obtain the filtrate and filter residue, and reclaim the salt solution containing the active metal from the filtrate;

[0091] S3. Add the filter residue to the above-mentioned anode rotary mortar electrolysis device, electrolytically dissolve the copper particles on the substrate in the electrolyte, and make the precious metal deposited on the copper surface detach from the substrate, and at the same time recover the refined copper at the cathode;

[0092] S4. Transfer the precious metal and resin in the anode tank to CCl 4 In the flotation agent, the difference in density is used to precipitate the precious metal, the resin floats...

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Abstract

The invention relates to a method for achieving classified recovery of metals in circuit boards, in particular to a method for recycling copper, tin, nickel, palladium, gold, silver and resin in the circuit boards. The method comprises the technological processes such as smashing, acid leaching, anode rotating forced-striking electrolysis and floatation. The method comprises the steps that the circuit boards are smashed into tiny fragments firstly; then the tiny fragments are subjected to acid leaching to enable reactive metal tin or nickel to be dissolved out; insoluble substances are placedin an anode rotating forced-striking electrolysis bath to be electrolyzed for recycling copper; anodic filter residues are obtained after filtering is conducted and transferred into water or heavy oilfor floatation, by means of density differences of the metals, resins and solvents, noble metals settles, the resins float on the surface and is separated, and resin powder is recycled on the upper layer; and finally, the noble metals are smelted and further separated. According to the method, various metals and resins can be separated and recycled form the waste circuit boards, and an environment-friendly process for recycling all resources in the circuit boards is achieved.

Description

technical field [0001] The invention relates to a method for classifying and recycling metals in circuit boards, in particular to separating and recycling various metals and resins from waste circuit boards in the printed circuit industry. Background technique [0002] In the multi-layer circuit board manufacturing technology, the pattern circuit is generally produced on the copper layer on the surface of the substrate through the imaging transfer and etching process, and then the copper and the prepreg (composed of insulating resin and glass fiber) are laminated and laminated layer by layer. Into a semi-finished product, and then covered with a layer of ink solder mask for anti-soldering effect, and then metallized surface treatment on the pad, surface treatment includes immersion gold, nickel palladium gold, immersion silver, spray tin and OSP (organic solder protection film ) and other processes, after the circuit board is manufactured, the components need to be mounted...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C25C1/12C25C7/00C22B11/00B29B17/02
CPCB29B17/02B29B2017/0244B29B2017/0268C22B7/007C22B11/046C25C1/12C25C7/00C25C7/007Y02W30/52Y02W30/62Y02P10/20
Inventor 刘根梁鸿飞陈世金郭茂桂周国云张胜涛韩志伟
Owner BOMIN ELECTRONICS CO LTD
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