Method for recycling gold, silver and copper sulfate from waste printed circuit boards
A printed circuit board and gold recycling technology, which is applied to the improvement of process efficiency, photographic technology, instruments, etc., can solve the problems of difficult disposal of waste printed circuit boards and low market value of products, so as to highlight the significance of environmental protection and economic benefits, and solve the problems The effect of palladium and silver separation interference and short process flow
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0041] A method for reclaiming gold, silver and copper sulfate from waste printed circuit boards, comprising the following steps:
[0042] Step 1: Crushing waste printed circuit boards to obtain charge with a particle size of 10-30mm;
[0043] Step 2: Mix the charge and additives obtained in step 1 according to the mass ratio of 1:0.002 to obtain a mixed charge, put the mixed charge into the furnace at a speed of 80kg / h, and calcinate at 850°C to obtain molten material and slag; The additive is calcium oxide;
[0044] Step 3: adding mass fraction of 65% sulfuric acid to the molten material obtained in step 2, the added amount is 18% of the total weight of the molten material, leaching at room temperature for 5 hours, and filtering to obtain leaching solution and leaching residue;
[0045] Step 4: Extract the copper from the leachate obtained in step 3 with extractant A. The extractant A is M5640 provided by Zhongqin Kangpu Chemical Industry Co., Ltd., and the amount added is ...
Embodiment 2
[0048] A method for reclaiming gold, silver and copper sulfate from waste printed circuit boards, comprising the following steps:
[0049] Step 1: Crushing waste printed circuit boards to obtain furnace charges with a particle size of 60-80 mm;
[0050] Step 2: Mix the charge and additives obtained in step 1 according to the mass ratio of 1:0.002 to obtain a mixed charge, put the mixed charge into the furnace at a rate of 150kg / h, and calcinate at 950°C to obtain molten material and slag; The additive is calcium oxide and silicon oxide mixed in a mass ratio of 1:1;
[0051] Step 3: adding mass fraction of 95% sulfuric acid to the molten material obtained in step 2, the added amount is 8% of the total weight of the molten material, leaching at room temperature for 4 hours, and filtering to obtain leaching solution and leaching residue;
[0052] Step 4: Extract the copper from the leaching solution obtained in step 3 with extractant A. The extraction agent A is M5640 provided b...
Embodiment 3
[0055] A method for reclaiming gold, silver and copper sulfate from waste printed circuit boards, comprising the following steps:
[0056] Step 1: Crushing waste printed circuit boards to obtain furnace charges with a particle size of 50-90 mm;
[0057] Step 2: Mix the charge obtained in step 1 with the additive according to the mass ratio of 0.003 to obtain a mixed charge, put the mixed charge into the furnace at a speed of 165kg / h, and calcinate at 950°C to obtain molten material and slag; the additive is Calcium Oxide;
[0058] Step 3: adding 75% sulfuric acid by mass fraction to the molten material obtained in step 2, the added amount is 14% of the total weight of the molten material, leaching at room temperature for 5 hours, and filtering to obtain the leachate and leach residue;
[0059] Step 4: Extract the copper from the leach solution obtained in step 3 with extractant A. The extractant A is M5640 provided by Zhongqin Kangpu Chemical Industry Co., Ltd., and the amoun...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com