Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for recycling gold, silver and copper sulfate from waste printed circuit boards

A printed circuit board and gold recycling technology, which is applied to the improvement of process efficiency, photographic technology, instruments, etc., can solve the problems of difficult disposal of waste printed circuit boards and low market value of products, so as to highlight the significance of environmental protection and economic benefits, and solve the problems The effect of palladium and silver separation interference and short process flow

Inactive Publication Date: 2018-12-14
李桃英
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for recovering gold, silver and copper sulfate from waste printed circuit boards in order to overcome the problems that the existing waste printed circuit boards are difficult to handle and the product market value is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A method for reclaiming gold, silver and copper sulfate from waste printed circuit boards, comprising the following steps:

[0042] Step 1: Crushing waste printed circuit boards to obtain charge with a particle size of 10-30mm;

[0043] Step 2: Mix the charge and additives obtained in step 1 according to the mass ratio of 1:0.002 to obtain a mixed charge, put the mixed charge into the furnace at a speed of 80kg / h, and calcinate at 850°C to obtain molten material and slag; The additive is calcium oxide;

[0044] Step 3: adding mass fraction of 65% sulfuric acid to the molten material obtained in step 2, the added amount is 18% of the total weight of the molten material, leaching at room temperature for 5 hours, and filtering to obtain leaching solution and leaching residue;

[0045] Step 4: Extract the copper from the leachate obtained in step 3 with extractant A. The extractant A is M5640 provided by Zhongqin Kangpu Chemical Industry Co., Ltd., and the amount added is ...

Embodiment 2

[0048] A method for reclaiming gold, silver and copper sulfate from waste printed circuit boards, comprising the following steps:

[0049] Step 1: Crushing waste printed circuit boards to obtain furnace charges with a particle size of 60-80 mm;

[0050] Step 2: Mix the charge and additives obtained in step 1 according to the mass ratio of 1:0.002 to obtain a mixed charge, put the mixed charge into the furnace at a rate of 150kg / h, and calcinate at 950°C to obtain molten material and slag; The additive is calcium oxide and silicon oxide mixed in a mass ratio of 1:1;

[0051] Step 3: adding mass fraction of 95% sulfuric acid to the molten material obtained in step 2, the added amount is 8% of the total weight of the molten material, leaching at room temperature for 4 hours, and filtering to obtain leaching solution and leaching residue;

[0052] Step 4: Extract the copper from the leaching solution obtained in step 3 with extractant A. The extraction agent A is M5640 provided b...

Embodiment 3

[0055] A method for reclaiming gold, silver and copper sulfate from waste printed circuit boards, comprising the following steps:

[0056] Step 1: Crushing waste printed circuit boards to obtain furnace charges with a particle size of 50-90 mm;

[0057] Step 2: Mix the charge obtained in step 1 with the additive according to the mass ratio of 0.003 to obtain a mixed charge, put the mixed charge into the furnace at a speed of 165kg / h, and calcinate at 950°C to obtain molten material and slag; the additive is Calcium Oxide;

[0058] Step 3: adding 75% sulfuric acid by mass fraction to the molten material obtained in step 2, the added amount is 14% of the total weight of the molten material, leaching at room temperature for 5 hours, and filtering to obtain the leachate and leach residue;

[0059] Step 4: Extract the copper from the leach solution obtained in step 3 with extractant A. The extractant A is M5640 provided by Zhongqin Kangpu Chemical Industry Co., Ltd., and the amoun...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for recycling gold, silver and copper sulfate from waste printed circuit boards. The method comprises the steps of crushing the waste printed circuit boards so as toobtain charging materials, putting into a smelting furnace to be calcined so as to obtain molten materials and slag, adding sulfuric acid to the molten materials to be leached, and filtering so as toobtain a leaching solution and leaching residues, wherein the leaching solution is evaporated and crystallized so as to obtain copper sulfate after copper is extracted, raffinate is electrolyzed so asto prepare silver, aqua regia is added to the leaching residues, and the obtained solution is extracted so as to obtain gold. The method has the advantages of short process flow and high practicability, is especially suitable for waste printed circuit board raw materials of which the copper content is higher than 20% and has obvious environmental significance and economic benefits, and high-valueproducts such as gold and silver and copper sulfate are obtained from the waste printed circuit boards.

Description

technical field [0001] The invention relates to a method for recycling waste circuit board resources, in particular to a method for recovering gold, silver and copper sulfate from waste printed circuit boards. Background technique [0002] With the rapid development of my country's electronics industry and the rapid replacement of electronic products, the environmental problems caused by the generated electronic waste have become increasingly prominent. For example, in my country, more than 25 million household appliances are discarded and updated annually, with an average annual growth rate of 3%-5%. The electronic waste generated by this item alone is estimated to reach 100 million tons by 2020. Waste printed circuit boards (WPCBs) are common items in electronic waste. Because they contain a variety of toxic and harmful components, they are difficult to deal with by conventional methods, and generally need to be removed from electronic devices and stored separately. Waste...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22B7/00C22B11/02C22B15/00C25C1/12
CPCC22B7/001C22B7/006C22B11/025C22B11/046C22B15/0056C22B15/0084C25C1/12Y02P10/20
Inventor 章琼李桃英
Owner 李桃英
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products