Efficient OLED evaporation equipment

Abstract

The invention relates to efficient OLED evaporation equipment. The efficient OLED evaporation equipment comprises an evaporation working device and an OLED substrate feeding device which are horizontally arranged in the front-back direction. According to the efficient OLED evaporation equipment, the centrifugal principle and the advantages of a hollow shaft motor structure are utilized, the original basic horizontal spreading arrangement design is changed into annular barrel-shaped arrangement, thus, a single vacuum cavity can contain more OLED substrates, meanwhile, the effect similar to thecentrifugal effect is generated through rotation of the OLED substrates, and the force, colliding the substrates, of evaporation material molecules in the vacuum cavity is remarkably improved; and theuniform degree of evaporated films can be increased while the production efficiency is improved, the overall structure leakproofness is good, and pollution leakage is reduced.

Description

technical field [0001] The invention relates to the technical field of OLED manufacturing, in particular to a high-efficiency OLED evaporation equipment. Background technique [0002] In the known technical field, the front plate process is the most important link in the entire OLED process. The specific process is: after cleaning and drying the TFT substrate in different ways, it is sent to a nitrogen environment for cooling, and the substrate is reversed. Make the membrane face down. The processed substrate is sent into a vacuum chamber for evaporation of various functional layers and luminescent layers. After evaporation, AMOLED is tested for functionality and appearance, and polarizers are attached, and finally enters the module segment process. [0003] In the evaporation process of OLED, special evaporation equipment is needed. The so-called evaporation refers to heating methods such as current heating in vacuum, electron beam bombardment heating or laser heating, so...

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Problems solved by technology

[0004] 1. The replacement of the evaporation source: After the evaporation material is exhausted, it needs to be removed from the vacuum chamber for addition or replacement. How to reduce the frequency of replacement and effectively ensure the air pressure treatment of the vacuum chamber before and after the replacement, It is extremely critical to improve production efficiency and reduce downtime and maintenance rates. At the same time, it is also prone to pollution problems. The existing equipment generally designs the vacuum chamber to be directly opened and closed. The replacement of the evaporation source is more frequent, and the vacuum The vacuuming process of the chamber takes a long time, and it is difficult to accurately quantify the control of the temperature process, which requires continuous intermittent repeated debugging in production

[0005] 2. The number of OLED panels processed at a time in the vacuum chamber: the general idea of ​​the existing evaporation equipment is to arrange the substrates horizontally, so the evaporation source generally needs to be placed above the substrate. Although the layout method is relatively mature, this method needs to consider the stability of process parameter control. It is impossible to place a large number of substrates in the same vacuum chamber in a large area, so the number of single processing is small, and it takes up a lot of space. The requirements are high, and with the increase in the size of the processed substrate, the structural arrangement of the evaporation heating device is more complicated, and the stability of the process parameters is more difficult to control

[0006] 3. Stability of evaporation process parameters: Traditional evaporation equipment generally adsorbs the substrate through the free movement of evaporation material molecules, and the parameters that can be controlled in the evaporation process are basically only the temperature and the arrangement of the heating source, so The process stability has not been high, which leads to the problem of poor yield rate. The solution for actual mass production can only be to continuously adjust the best parameters to improve the uniformity of the coating

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