Method for measuring temperature of test piece in thermo-electric-force coupling test system

Abstract

The invention discloses a method for measuring temperature of a test piece in a thermo-electric-force coupling test system, and relates to electronic package material mechanical property testing technology. The test piece is welded by two copper rods and clamped on a stretcher. A certain intensity current is applied to the test piece at the same time. The rmocouple thermometer and thermal resistance thermometer cannot directly contact the surface of the test piece since the test piece itself passes a relatively strong current. Before the test begins, the test piece is gauged by using a verniercaliper, and two contacts of a voltage measuring instrument is connected to two ends of the gauge length to measure voltage drop in the gauge length; the segment comprises solder joints to accuratelymeasure the voltage drop; and the temperature-voltage relationship of the test piece is calculated according to the resistivity-temperature curve of the copper and SAC305 solder, combined with the cross-sectional shape of the test piece and the gauge length to obtain the corresponding relationship between the temperature and the voltage drop of the test piece. The method for measuring temperatureof the test piece is simple, and has high measurement accuracy and is easy to test and record.

Description

technical field [0001] The invention relates to a technology for testing the mechanical properties of electronic packaging materials, in particular to a method for measuring the temperature of a test piece used in a thermo-electric-force coupling test system. Background technique [0002] Electronic packaging technology plays a vital role in electronic products. The interconnection solder joints in the electronic packaging structure are the key parts of the microelectronic chip. They not only provide mechanical support for the chip and the substrate, but also are an important way for electrical connection and heat dissipation. High-performance electronic products generally contain tens of thousands of solder joints, and the failure of a single solder joint at a critical position may lead to the loss of the function of the entire electronic chip. In a sense, the reliability of the mechanical properties of interconnection solder joints determines the reliability of the entire...

AI Technical Summary

Problems solved by technology

In the existing method for measuring the temperature of the specimen in the thermal-electrical-mechanical multi-field coupling test, the measurement error is generally too large, the cost of the measuring instrument is high, and the data recording is inconvenient.

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