4D printing crack-free special substrate made of titanium-nickel shape memory alloy and preparation method thereof

A memory alloy, crack-free technology, applied in the direction of additive processing, etc., can solve the problems of inability to prepare workpieces with complex shapes, affect the performance, and cracks are easy to occur on the titanium-nickel substrate, achieve high hardness and strength, and hinder grain growth , the effect of not easy to crack

Active Publication Date: 2019-01-01
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods have a common disadvantage: they cannot prepare workpieces with complex shapes
The preparation of Ti-Ni shape memory alloy by SLM requires the use of Ti-Ni substrates with the same composition, but the Ti-Ni substrates prepared by the existing process methods are prone to cracks, which affect their performance.

Method used

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  • 4D printing crack-free special substrate made of titanium-nickel shape memory alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The special substrate for 4D printing titanium-nickel shape memory alloy without cracks, the weight percentage of each component is as follows: Ni: 60%, Ti: 37%, Zr: 3%.

[0029] A method for preparing a crack-free 4D printed titanium-nickel shape memory alloy special substrate, comprising the following steps:

[0030] Mixing micron grade pure Ni powder, pure Ti powder and pure Zr powder, and adding 2wt% polyvinyl alcohol binder to fully mix;

[0031] Press the mixed NiTiZr powder according to the pressure of 400 tons;

[0032] The NiTiZr powder is sintered into a plate by conventional vacuum sintering method, the sintering parameters are: sintering temperature 1100°C, sintering time 4h, and the NiTiZr plate is processed into a special substrate for 4D printing titanium-nickel shape memory alloy.

[0033] The special substrate for 4D printing titanium-nickel shape memory alloy prepared by the above method has no cracks, a hardness of 280HV, and a tensile strength of 76...

Embodiment 2

[0035] A special substrate for 4D printing titanium-nickel shape memory alloy without cracks, the weight percentage of each component is as follows: Ni: 60%, Ti: 38%, Zr: 2%.

[0036] A method for preparing a crack-free 4D printed titanium-nickel shape memory alloy special substrate, comprising the following steps:

[0037] Mix micron grade pure Ni powder, pure Ti powder and pure Zr powder, and add 1wt% polyvinyl alcohol binder to fully mix;

[0038] The mixed NiTiZr powder is pressed into shape according to a pressure of 390 tons;

[0039] The NiTiZr powder is sintered into a plate by conventional vacuum sintering method. The sintering parameters are: sintering temperature 1080°C, sintering time 3h, and the NiTiZr plate is processed into a special substrate for 4D printing titanium-nickel shape memory alloy.

[0040] The special substrate for 4D printing titanium-nickel shape memory alloy prepared by the above method has no cracks, a hardness of 290HV, and a tensile strength...

Embodiment 3

[0042] A special substrate for 4D printing titanium-nickel shape memory alloy without cracks, the weight percentage of each component is as follows: Ni: 60%, Ti: 39%, Zr: 1%.

[0043] A method for preparing a crack-free 4D printed titanium-nickel shape memory alloy special substrate, comprising the following steps:

[0044] Mix micron grade pure Ni powder, pure Ti powder and pure Zr powder, and add 3wt% polyvinyl alcohol binder to fully mix;

[0045] Press the mixed NiTiZr powder according to the pressure of 380 tons;

[0046] The NiTiZr powder is sintered into a plate by conventional vacuum sintering method, the sintering parameters are: sintering temperature 1060°C, sintering time 2h, and the NiTiZr plate is processed into a special substrate for 4D printing titanium-nickel shape memory alloy.

[0047] The special substrate for 4D printing titanium-nickel shape memory alloy prepared by the above method has no cracks, a hardness of 295HV, and a tensile strength of 775MPa.

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Abstract

The invention discloses a 4D printing crack-free special substrate made of a titanium-nickel shape memory alloy and a preparation method thereof. The substrate is prepared from 40 to 80 percent by mass of Ni, 10 to 60 percent by mass of Ti and 2 to 10 percent by mass of Zr. The prepared 4D printing crack-free special substrate made of the titanium-nickel shape memory alloy has high hardness, highstrength, high toughness and insusceptibility to cracking.

Description

technical field [0001] The invention belongs to the technical field of alloy preparation and additive manufacturing, and in particular relates to a special substrate for 4D printing crack-free titanium-nickel shape memory alloy and a preparation method thereof. Background technique [0002] Titanium-nickel shape memory alloy is the earliest developed memory alloy. Since its development in 1963, it has been widely valued by the material science and engineering circles because of its excellent memory effect, stable performance and good biocompatibility. Due to the high processing cost and complicated preparation and processing technology of titanium-nickel shape memory alloy, its application in many fields is limited. In order to solve these problems, researchers need to continuously develop new preparation processes. There are five existing methods for preparing Ti-Ni shape memory alloys except SLM: melting method, powder metallurgy method, discharge sintering method, Ti-Ni ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C19/03C22C14/00C22C1/04B33Y70/00
CPCB33Y70/00C22C1/0433C22C1/0458C22C14/00C22C19/03
Inventor 李瑞迪袁铁锤李澜波王敏卜牛朋达宋波史玉升陈超
Owner CENT SOUTH UNIV
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