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Method for preparing high-refractive index nano-composite silicone encapsulation adhesive

A technology of nanocomposite and encapsulating adhesive materials, which is applied in the field of LED packaging and optical material preparation, and can solve the problems of particle reunion compatibility, small particle size of nano oxide particles, and difficulty in agglomeration.

Active Publication Date: 2019-01-08
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method uses molecular mixing and strengthening technology to generate nano-oxide particles in situ in the encapsulation adhesive. The in-situ generation technology allows nano-zirconia particles to be directly generated in the glue solution. The problems of particle agglomeration and poor compatibility encountered after doping nanoparticles into organic substrates endow the product with higher application performance and a wider range of applications

Method used

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  • Method for preparing high-refractive index nano-composite silicone encapsulation adhesive
  • Method for preparing high-refractive index nano-composite silicone encapsulation adhesive
  • Method for preparing high-refractive index nano-composite silicone encapsulation adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1) Weigh 37.04 g of zirconium n-propoxide, 23.56 g of acetic acid, and 50 g of OE-6636A glue in a beaker to dissolve with 100 ml of solvent, and control the temperature of the solution at about 0°C;

[0035] 2) Measure 4.10 g of water and dissolve it with 4 ml of solvent in a beaker, and control the temperature of the solution at about 0°C;

[0036] 3) Simultaneously send the solutions in the two beakers into the high gravity reactor, pass circulating water into the reactor, adjust the system temperature to a preset temperature, control the reactor speed to 500 rpm, and the circulation time is 10 minutes;

[0037] 4) The resulting solution was evaporated under reduced pressure at 50°C for 30 minutes, and 50 grams of OE-6636B glue was added. After testing, the particle size of nano-zirconia uniformly dispersed in silica gel is 2 nanometers. The film is prepared by spin coating (4000 rpm, 15 seconds), and cured at 100 degrees for 1.5 hours. The composite packaging adhesive has ...

Embodiment 2

[0039] 1) Weigh 0.3704 g of tetraisopropyl titanate, 0.2356 g of acetic acid and 0.5 g of OE-6636A glue in a beaker and dissolve with 100 ml of solvent, and control the temperature of the solution at 0°C

[0040] about;

[0041] 2) Measure 0.0410 g of water and dissolve it with 4 ml of solvent in a beaker, and control the temperature of the solution at about 0°C;

[0042] 3) Simultaneously send the solutions in the two beakers into the high gravity reactor, pass circulating water into the reactor, adjust the system temperature to a preset temperature, control the reactor speed to 500 rpm, and the circulation time is 10 minutes;

[0043] 4) The resulting solution was rotary evaporated under reduced pressure at 50°C for 30 minutes, and 0.5 g of OE-6636B glue was added. After testing, the particle size of nano titanium oxide uniformly dispersed in silica gel is 2.5 nanometers. The film was prepared by spin coating (4000 rpm, 15 seconds), and cured at 100 degrees for 1.5 hours. The compo...

Embodiment 3

[0045] 1) Weigh 0.277 g of zirconium n-propoxide, 0.101 g of acetic acid, and 0.468 g of organic silica gel A, and dissolve it in a bottle with 1.667 ml of solvent, and control the temperature of the solution at about 0°C;

[0046] 2) Add 0.030 grams of water to the solution prepared in 1), and control the temperature of the solution at about 0°C;

[0047] 3) Put the solution in an ice water bath and sonicate for 40 minutes to obtain a transparent zirconia nanoparticle dispersion.

[0048] 4) The resulting solution was rotary evaporated under reduced pressure at 50°C for 30 minutes, and 0.5 g of OE-6636B glue was added. After testing, the particle size of nano-zirconia uniformly dispersed in silica gel is 3.7 nanometers. The film is prepared by spin coating (4000 revolutions per minute, 1 second), and cured at 100 degrees for 1.5 hours. The composite packaging adhesive has a refractive index of 1.590 and a transmittance of 97%.

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Abstract

The invention discloses a method for preparing high-refractive index nano-composite silicone encapsulation adhesive. The method uses a molecular mixing and strengthening technology to generate nano-oxide particles in situ in an encapsulation adhesive, uses an in-situ formation technology to directly generate nano-zirconia particles in an adhesive solution, wherein the nano-oxide particles have extremely small particle size and are not easy to agglomerate, so that problems of particle agglomeration and poor compatibility when synthesizing and doping nanoparticles in an organic base material aresolved, and the product is endowed with higher application performance and wider application range. The obtained solvent-removed transparent adhesive is poured into a mold or an optical device and cured at 100-150 DEG C to prepare a transparent and refractive index-adjustable nano-composite silicone resin adhesive, which can be used for manufacturing high-refractive index optical composite films,high-refractive index encapsulation adhesives, optical sensors, optical elements and the like.

Description

Technical field [0001] The invention relates to the field of LED packaging and optical material preparation, in particular to a preparation method of a high-refractive index nano-composite organic silicon packaging adhesive material. Background technique [0002] As a cold light source, LED lamps have the characteristics of being safer, longer-lived, and more environmentally friendly than incandescent lamps, and are more and more widely used in all aspects of production and life. LED packaging materials refer to plastic packaging materials used to package light-emitting chips. Compared with common packaging materials, such as integrated circuit packaging materials, LED packaging materials not only require protection of the chip to prevent long-term exposure or mechanical damage to failure, but also It is required to be translucent, so that the light emitted by the light-emitting chip can pass through the packaging material to meet the lighting requirements. The refractive index ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/06C08K3/22C08G83/00
CPCC08G77/06C08G83/001C08K3/22C08K2003/2241C08K2003/2244C08K2201/011
Inventor 蒲源何相磊唐睿婕王丹王洁欣曾晓飞陈建峰
Owner BEIJING UNIV OF CHEM TECH
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