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Preparation method for alumina dispersion strengthened copper alloy metallographic sample

A technology for dispersion strengthening of copper and alumina, which is applied in the preparation of test samples, etc., can solve the problem that alumina dispersion strengthened copper alloy cannot fully corrode the metallographic structure.

Active Publication Date: 2019-01-15
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to "Metallographic Sample Preparation and Display Technology" (edited by Han Dewei, Zhang Jianxin, Central South University Press, 2005.3, the first edition), the use of conventional copper and copper alloy corrosion solutions cannot obtain real and clear aluminum oxide dispersion strengthened copper gold. phase organization
So far, the main commonly used corrosive solutions for copper and copper alloys include: HNO 2 Add water, HNO 3 Add HF, nitric acid high ferric alcohol solution, etc., but for aluminum oxide dispersion strengthened copper alloy, the ideal metallographic structure cannot be fully corroded

Method used

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  • Preparation method for alumina dispersion strengthened copper alloy metallographic sample
  • Preparation method for alumina dispersion strengthened copper alloy metallographic sample
  • Preparation method for alumina dispersion strengthened copper alloy metallographic sample

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Take two alumina dispersion strengthened copper alloy samples 1# and 2#.

[0021] (1) Using water as a lubricant, rough grinding is carried out by grinding and polishing with P240, P400, P800, P1000, P1500, and P2000 sandpaper respectively. The speed of the grinding and polishing machine is 600 rpm. The direction of grinding and polishing is 90°, and it is observed under a microscope to confirm that there are no scratches on the surface.

[0022] (2) Finely grind with P3000 sandpaper, the speed of the grinding and polishing machine is 800 rpm, first grind off the scratches of the rough grinding along the direction perpendicular to the scratches of the rough grinding, then turn 90°, and grind it again, at 100 times Observe the surface state of the sample under a microscope to confirm that the scratches on the surface are in the same direction, and then rinse the surface of the sample with water.

[0023] (3) Perform mechanical polishing with abrasive paste with a partic...

Embodiment 2

[0027] Take two alumina dispersion strengthened copper alloy samples 3# and 4#.

[0028] (1) Using water as a lubricant, rough grinding is carried out by grinding and polishing with P240, P400, P800, P1000, P1500, and P2000 sandpaper respectively. The speed of the grinding and polishing machine is 600 rpm. The direction of grinding and polishing is 90°, and it is observed under a microscope to confirm that there are no scratches on the surface.

[0029] (2) Finely grind with P3000 sandpaper, the speed of the grinding and polishing machine is 800 rpm, first grind off the scratches of the rough grinding along the direction perpendicular to the scratches of the rough grinding, then turn 90°, and grind it again, at 100 times Observe the surface state of the sample under a microscope to confirm that the scratches on the surface are in the same direction, and then rinse the surface of the sample with water.

[0030] (3) Perform mechanical polishing with abrasive paste with a partic...

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Abstract

The invention belongs to the technical field of metallographic sample preparation, and discloses a preparation method for an alumina dispersion strengthened copper alloy metallographic sample. The method comprises the specific steps of coarse grinding, finish grinding, mechanical polishing, electrolytic polishing and electrolytic corrosion. An electrolytic polishing and corrosion solution used inelectrolytic polishing is prepared from phosphoric acid, glacial acetic acid and water, wherein the ratio of phosphoric acid to glacial acetic acid to water is 2:1:1, and according to electrolytic parameters, the current density is 0.5-2.0A, the voltage is 10-20V, and the electrolysis time is 60-120s. According to the preparation method, a stress layer can be effectively removed, phase films are not generated, and a real surface is obtained. Real alloy metallographic phases displaying nano alumina particles or clear crystal boundary structures can be obtained separately by finely adjusting theelectrolytic corrosion process, and the method is simple, reliable, economical, efficient and suitable for preparing and displaying the alumina dispersion strengthened copper alloy metallographic phases.

Description

technical field [0001] The invention belongs to the technical field of metallographic sample preparation, in particular to a method for preparing aluminum oxide dispersion strengthened copper alloy metallographic samples. Background technique [0002] The rapid development of the high-tech field has put forward higher and newer requirements for the performance of new high-strength and high-conductivity copper-based composite materials. It is difficult to solve the contradictory relationship between the conductivity and strength of materials by using traditional strengthening mechanisms. However, the copper-based composite material prepared by the dispersion strengthening mechanism is not easy to dissolve and grow and coarsen at high temperature, and can inhibit the recrystallization process, effectively pinning dislocations and hindering dislocation movement and grain boundary slippage. The strength and high-temperature characteristics of the composite material are significa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/32G01N1/34
CPCG01N1/32G01N1/34
Inventor 李增德李卿
Owner GRIMAT ENG INST CO LTD