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Adhesive composition and adhesive sheet

A composition and adhesive technology, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve problems such as circuit damage, and achieve the effect of inhibiting peeling electrification

Inactive Publication Date: 2019-01-18
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Peeling electrification may cause electrostatic barriers such as circuit breakage on the adherend

Method used

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  • Adhesive composition and adhesive sheet
  • Adhesive composition and adhesive sheet
  • Adhesive composition and adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0220] Hereinafter, the present invention will be described more concretely by way of examples and comparative examples. In addition, this invention is not limited only to a following example.

[0221] Unless otherwise specified, "%" and "part" in the following description are mass standards.

[0222] The solid content and glass transition temperature of (meth)acrylic-type resin (A-1)-(A-4) manufactured in the following manufacture examples 1-4 were measured by the following method.

[0223] In addition, the (meth)acrylic resins (A-1) to (A-4) produced in Production Examples 1 to 4, and the polyfunctional epoxy (meth)acrylates produced in Production Examples 5 to 6 (B The weight average molecular weights of -1) and (B-2) were measured by the following method.

[0224]

[0225]Weigh 2 g of each of the produced (meth)acrylic resins (A-1) to (A-4), dry them at 110° C. for 5 hours, and weigh them again. The mass before drying and the mass after drying Based on the quality of ...

manufacture example 1

[0240] Production Example 1

[0241] Add 251.7 parts of butyl acrylate, 76.7 parts of ethyl acrylate, 17.2 parts of methyl methacrylate, 2.8 parts of acrylic acid, 2 - 1.8 parts of hydroxyethyl ester and 645 parts of ethyl acetate as a solvent. After heating to reflux was started, 0.1 part of azobisisobutyronitrile was added as a polymerization initiator and reacted at ethyl acetate reflux temperature for 3 hours. Then, a solution obtained by dissolving 0.1 part of azobisisobutyronitrile in 5 parts of ethyl acetate was added, and further reacted at reflux temperature for 4 hours. Thereby, the (meth)acrylic-type resin (A-1) of solid content 35%, a weight average molecular weight 650,000, and glass transition temperature -40 degreeC was obtained.

manufacture example 2

[0242] Production Example 2

[0243] Add 246.4 parts of butyl acrylate, 76.7 parts of ethyl acrylate, 17.2 parts of methyl methacrylate, 2.8 parts of acrylic acid, 2 - 7.0 parts of hydroxyethyl ester and 645 parts of ethyl acetate as a solvent. After heating to reflux was started, 0.1 part of azobisisobutyronitrile was added as a polymerization initiator and reacted at ethyl acetate reflux temperature for 3 hours. Then, a solution obtained by dissolving 0.1 part of azobisisobutyronitrile in 5 parts of ethyl acetate was added, and further reacted at reflux temperature for 4 hours. Thereby, the (meth)acrylic-type resin (A-2) of solid content 35%, a weight average molecular weight 670,000, and glass transition temperature -40 degreeC was obtained.

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Abstract

An adhesive composition includes: a copolymer (A) which contains 1-5 mol% of a component sourced from a monomer (a-1) being more than 9.50(cal / cm<3>)0.5 in SP value, and 95-99 mol% of a component sourced from a monomer (a-2) being less than 9.50(cal / cm<3>)0.5 in SP value; a component (B) represented as the formula (1); and (E) an ionic liquid. In the formula (1), R1 is hydrogen atom or methyl group, R2 is hydrogen atom or a group having an alkene unsaturated bond, R3 is hydrogen atom or a group having an alkene unsaturated bond, X is a group in ring structure, and n is a positive integer.

Description

technical field [0001] The present invention relates to an adhesive composition and an adhesive sheet. [0002] This application claims priority based on Japanese Patent Application No. 2017-135534 for which it applied in Japan on July 11, 2017, and uses the content here. Background technique [0003] Cutting is performed when manufacturing electrical parts, electronic parts, semiconductor parts, and other parts. In the dicing process, a wafer formed with a plurality of parts is cut and divided into individual parts to form small pieces (chips) of elements. [0004] Conventionally, wafer processing such as dicing processing has been performed with an adhesive sheet such as an adhesive tape attached to the wafer. By affixing the adhesive sheet to the wafer, components provided on the wafer to be processed are fixed and the surface of the wafer to be processed is protected. The adhesive tape attached to the wafer is peeled off after the wafer processing is completed. [00...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J163/10C09J11/06C09J7/30C09J7/25
CPCC09J7/25C09J7/30C09J11/06C09J133/066C09J2433/00C09J2467/006C08L63/10C08K5/205
Inventor 池谷达宏佐佐木一博中西健一
Owner SHOWA DENKO KK