Reflow soldering simulation optimization method, system, computer storage medium and apparatus

An optimization method, reflow soldering technology, applied in computer-aided design, calculation, CAD circuit design, etc., to achieve the effect of improving manufacturing quality and manufacturing efficiency

Active Publication Date: 2019-01-18
VAYO SHANGHAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, how to provide a simulation optimization method, system, computer storage medium and equipment of a kind of reflow soldering, to solve the defects such as the soldering of SMD component just can find the welding of S

Method used

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  • Reflow soldering simulation optimization method, system, computer storage medium and apparatus
  • Reflow soldering simulation optimization method, system, computer storage medium and apparatus
  • Reflow soldering simulation optimization method, system, computer storage medium and apparatus

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0037] Example one

[0038] This embodiment provides a simulation optimization method for reflow soldering, including:

[0039] Generate a three-dimensional model of the PCB circuit board to be optimized;

[0040] According to the thickness of the stencil opening read one by one or the thickness of the stencil opening generated by the pad, the corresponding three-dimensional model of solder paste is generated;

[0041] Select the components that require reflow soldering process from the three-dimensional model of the PCB circuit board to be optimized. According to the position information of the selected components on the three-dimensional model of the PCB circuit board to be optimized, each component Set to the 3D solder paste model;

[0042] According to the preset simulation parameters of reflow soldering, perform solder paste soldering simulation on the selected components and pads to form a reflow soldering simulation model of the PCB circuit board to be optimized;

[0043] Perform...

Example Embodiment

[0079] Example two

[0080] This embodiment provides a reflow soldering simulation optimization system, including:

[0081] The generation module is used to generate the three-dimensional model of the PCB circuit board to be optimized;

[0082] The generation module is used to generate the corresponding three-dimensional solder paste model according to the thickness of the stencil openings read in one by one or the thickness of the stencil openings generated by the pad;

[0083] The setting module is used to select the components that require reflow soldering process from the three-dimensional model of the PCB circuit board to be optimized. According to the position information of the selected components on the three-dimensional model of the PCB circuit board to be optimized, each 1. The components are set on the three-dimensional solder paste model;

[0084] The simulation module is used to perform solder paste soldering simulation on the selected components and pads according to the ...

Example Embodiment

[0107] Example three

[0108] This embodiment provides a device that includes: a processor, a memory, a transceiver, a communication interface or / and a system bus; the memory and the communication interface are connected to the processor and the transceiver through the system bus to complete mutual communication, and the memory It is used to store computer programs, the communication interface is used to communicate with other devices, and the processor and transceiver are used to run the computer programs to make the device execute the steps of the reflow soldering simulation optimization method as described in the first embodiment.

[0109] The aforementioned system bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. The system bus can be divided into address bus, data bus, control bus and so on. The communication interface is used to realize the communication between the database access device and other devices (suc...

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Abstract

The invention provides a simulation optimization method, a system, a computer storage medium and a device for reflow soldering. The method comprises the following steps: generating a three-dimensionalmodel of a PCB circuit board to be optimized; Generating a corresponding solder paste three-dimensional model; selecting the components that need to be reflow soldered, and arranging each component on the solder paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB circuit board to be optimized. According to the preset simulation parameters of reflow soldering, solder paste soldering simulation is carried out on the selected components and pads to form the simulation model of PCB reflow soldering to be optimized. The reflow simulation model of PCB to be optimized is checked to find the problem to be optimized. For the problem to be optimized, the corresponding design and process optimization modifications are adopted. The invention can detect possible soldering problems in advance through the technology of reflow soldering simulation in the design stage, thereby enabling technicians to modify the designand optimize the process.

Description

technical field [0001] The invention belongs to the field of soldering technology, and relates to a simulation optimization method and system, in particular to a simulation optimization method, system, computer storage medium and equipment for reflow soldering. Background technique [0002] With the development of economy and science and technology, people have higher and higher requirements for electronic products, which must not only meet the requirements of multi-function, miniaturization, high density and high performance, but also need to have good product quality. As the core process of electronic assembly - SMT process, its welding quality directly affects the overall quality and production cost of the product. Therefore, for the electronics manufacturing industry, high-quality soldering quality is the foundation of the product and the capital and bargaining chip for the product to compete with others. [0003] At present, the welding defects in the industry can only...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/398G06F2115/06G06F2119/18
Inventor 钱胜杰刘丰收
Owner VAYO SHANGHAI TECH
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