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Satellite tuner circuit

A tuner and circuit technology, which is applied in TV, electrical components, color TV, etc., can solve the problems of AT3566 chip peripheral circuit complexity, increase design cost and design time, and hinder the miniaturization of integrated circuits, so as to reduce design cost and Design time, reduce size and design difficulty, achieve miniaturization effect

Active Publication Date: 2021-02-19
隔空微电子(广州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the application of the traditional AT3566 package structure in the Ku-band satellite TV tuner, not only need to use three low-noise amplifier chips AT101 and one AT3566 chip, but also need to design peripheral circuits for vertical polarization and horizontal polarization respectively. The peripheral circuit of the secondary low-noise amplifier is designed, and the peripheral circuit of the AT3566 chip is relatively complicated, which greatly increases the design cost and design time, and greatly increases the area of ​​the receiver, hindering the miniaturization of the integrated circuit. come many disadvantages

Method used

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Embodiment Construction

[0023] The specific implementation of the package structure of the down-conversion chip and the satellite tuner circuit provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] Please refer to figure 1 , is a schematic diagram of the internal structure of the package structure of the down-conversion chip according to a specific embodiment of the present invention.

[0025] The down-conversion chip package structure 100 includes: a lead frame, a first die 121 and a second die 122, and an encapsulant 130. The encapsulant 130 embeds the first die 121 and the second die 122 and exposes at least one side surface of the pins and the die layout area 110 .

[0026] The lead frame includes a die layout area 110 and a plurality of pins, and the plurality of pins are arranged around the die layout area 110 . In this specific embodiment, the down-conversion chip package structure 100 includes 16 pins, namely pin 1 to pin...

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Abstract

The invention relates to a package structure of a down-conversion chip and a satellite tuner circuit. The package structure includes: a lead frame, including a bare chip layout area and a plurality of pins, and the plurality of pins surround the bare chip layout area Setting: a first die and a second die, the first die includes a downconversion device, the second die includes a FET structure, and the FET structure is connected to the first die for The signal amplified by the second die is input to the first die, the gate of the FET structure is connected to one of the pins, and this pin is used as a radio frequency signal input lead of the down-conversion chip package structure foot. The down-conversion chip structure can reduce circuit area, improve circuit integration, thereby reducing cost, increase gain, reduce noise, and improve circuit performance.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a down-conversion chip packaging structure and a tuner circuit. Background technique [0002] With the rapid development of information technology and the rapid development of integrated circuits, the most important and core low-noise down-conversion technology in integrated circuits has also been greatly developed. With the rapid development of satellite technology in recent years, Ku-band satellite TV can be seen everywhere and plays an increasingly important role in people's daily entertainment life. People are increasingly inseparable from the variety of satellite TV. [0003] The low-noise down-conversion is located at the front end of the receiver and at the back end of the low-noise amplifier. Its main function is to modulate the RF signal to the intermediate frequency. It plays a vital role in extracting useful signals from the RF signal and improving the performance o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/50H04N7/20H04B1/16H04B1/00
CPCH04B1/005H04B1/16H04N5/50H04N7/20
Inventor 林水洋宋颖徐乃昊周智何德宽王志高
Owner 隔空微电子(广州)有限公司