Surface strengthening treatment method for gradient pure copper material

A technology of surface strengthening and treatment method, applied in the field of metal material processing, can solve problems such as plasticity reduction, and achieve the effect of simple treatment method, easy continuous production, and less capital investment in equipment

Inactive Publication Date: 2019-01-25
KUNMING UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the large ratio of the gradient structure layer and the coarse crystal layer in the double-si

Method used

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  • Surface strengthening treatment method for gradient pure copper material

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Example 1

[0016] (1) Anneal the 3mm pure copper plate at 600°C for 2.5 hours;

[0017] (2) Surface polishing the plate obtained in step (1). The polished pure copper plate is subjected to single-sided surface nano-treatment in a liquid nitrogen environment. The test frequency is 50 Hz, the steel balls are 100, the diameter is 8 mm, and the treatment time is 50 Hz. 15min.

[0018] The yield strength of the prepared surface nanometer gradient pure copper material can reach 170Mpa (such as figure 1 As shown in the curve of Example 1), it is 3 times that of annealed pure copper, and the uniform elongation reaches 19%, and it is 9 times that of the graded pure copper material prepared by double-sided surface nanometering, and the elongation at break can reach 38% , Has high strength and good plasticity.

[0019] Gradient pure copper material (such as figure 1 The average elongation is 2%, and the elongation at break is 35%.

Example Embodiment

[0020] Example 2

[0021] (1) Anneal 4mm pure copper sheet at 650℃ for 2 hours;

[0022] (2) Surface polishing the plate obtained in step (1). The polished pure copper plate is subjected to single-sided surface nano-treatment at room temperature. The test frequency is 50Hz, the steel balls are 150, the diameter is 8mm, and the treatment time is 15min. .

[0023] The yield strength of the prepared surface nanometer gradient pure copper material can reach 150Mpa (such as figure 1 As shown in the curve in Example 2), it is twice the annealed pure copper, and the uniform elongation reaches 35%. Compared with the gradient pure copper material prepared by double-sided surface nanometering, it has increased by 10%, and the fracture elongation can be Up to 65%, with high strength and good plasticity.

[0024] Gradient pure copper material (such as figure 1 As shown by the 4mm double-sided curve), the uniform elongation is 25%, and the elongation at break is 60%.

Example Embodiment

[0025] Example 3

[0026] (1) Anneal the 5mm pure copper plate at 700℃ for 1.5 hours;

[0027] (2) Surface polishing the plate obtained in step (1). The polished pure copper plate is subjected to single-sided surface nano-treatment at room temperature. The test frequency is 50Hz, the steel balls are 200, the diameter is 8mm, and the treatment time is 15min. .

[0028] The yield strength of the prepared surface nanometer gradient pure copper material can reach 140Mpa (such as figure 1 As shown in the curve in Example 3), it is twice the annealed pure copper, and the uniform elongation reaches 40%. Compared with the gradient pure copper material prepared by double-sided surface nano-crystallization, the elongation at break can be increased by 10%. Up to 60%, with high strength and good plasticity.

[0029] Gradient pure copper material (such as figure 1 The average elongation rate is 30%, and the elongation rate at break is 57%.

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Abstract

The invention discloses a surface strengthening treatment method for a gradient pure copper material, and belongs to the technical field of metal material processing. The method comprises the following steps that the pure copper material is annealed at the temperature of 600-700 DEG C for 1.5-2.5 hours, and single-side surface nanocrystallization treatment is carried out on the annealed pure copper material by adopting mechanical grinding at room temperature or in a liquid nitrogen environment so as to prepare the gradient nano pure copper material with high strength, high plasticity and goodstability. The method has the advantages that the preparation process is simple, and a sheet with the plasticity improved by 10% or above of a gradient pure copper material prepared through double-sided surface nanocrystallization and with relatively high strength can be obtained; and the prepared high-strength and high-plasticity pure copper material has wide application space in the fields of rapid-developed electronic communication, aerospace, machinery and the like.

Description

Technical field [0001] The invention relates to a surface strengthening treatment method of gradient pure copper material, and belongs to the technical field of metal material processing. Background technique [0002] Copper is one of the earliest metals used by humans. It is a non-ferrous metal closely related to humans. Because of its good electrical conductivity, thermal conductivity, ornamental properties, corrosion resistance and excellent mechanical properties, it has been widely used Cables, machinery manufacturing, electrical, electronic components, construction industry and other modern engineering technology fields can also be composed of many kinds of alloy materials. Various electronic products, household appliances, industrial facilities, etc. are inseparable from copper and copper alloy products, which are already indispensable and important engineering materials in production and life. In addition, copper is also an extremely durable metal, which can be recycled m...

Claims

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Application Information

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IPC IPC(8): C22F1/08
CPCC22F1/08
Inventor 孟丽芳朱心昆
Owner KUNMING UNIV OF SCI & TECH
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