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A solderable conductive silver paste capable of rapidly solidifying at a low temperature and a preparation method thereof

A conductive silver paste, fast curing technology, applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of welding, long curing time, inconvenient use, etc., to improve construction efficiency , Excellent printability, low volume resistivity effect

Inactive Publication Date: 2019-01-25
善仁(浙江)新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the patent CN105551571A discloses a conductive silver paste, its curing time is still long, and it cannot be directly welded with Sn, Sn / Bi, Sn / Pb, Cu, Ag and other materials, which is inconvenient to use

Method used

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  • A solderable conductive silver paste capable of rapidly solidifying at a low temperature and a preparation method thereof
  • A solderable conductive silver paste capable of rapidly solidifying at a low temperature and a preparation method thereof
  • A solderable conductive silver paste capable of rapidly solidifying at a low temperature and a preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The first step is to weigh 10% of resin, 1.0% of curing agent, 0.2% of accelerator, 1.5% of diluent, 0.2% of coupling agent, 0.28% of thixotropic agent, 0.3% of anti-sedimentation agent and conductive additive in order according to the mass parts 0.2%, stir and disperse with a high-speed disperser for 20-60 minutes to obtain a resin mixture.

[0026] The second step is to weigh a certain proportion of 86.32% silver powder, mix it with the above resin mixture, and stir and disperse it with a high-speed disperser for 20-60 minutes to obtain a uniform slurry.

[0027] In the third step, the prepared slurry is ground on a three-roll mill until the particle size distribution is less than 8 μm, and then passed through a 500-mesh polyester net to obtain a uniformly ground slurry.

[0028] The fourth step is to put the above slurry into the planetary degassing machine and rotate at 200rpm, rotate at 2000rpm for 15 minutes, and then the finished product can be obtained.

[0029...

Embodiment 2

[0031] The first step is to weigh 8% of resin, 0.75% of curing agent, 0.12% of accelerator, 1.1% of diluent, 0.13% of coupling agent, 0.19% of thixotropic agent, 0.15% of anti-sedimentation agent and conductive auxiliary agent in order according to parts by mass 0.18%, stir and disperse with a high-speed disperser for 20-60 minutes to obtain a resin mixture.

[0032] In the second step, a certain proportion of 89.38% silver powder is weighed, mixed with the above-mentioned resin mixture, and stirred and dispersed by a high-speed disperser for 20-60 minutes to obtain a uniform slurry.

[0033] In the third step, the prepared slurry is ground on a three-roll mill until the particle size distribution is less than 8 μm, and then passed through a 500-mesh polyester net to obtain a uniformly ground slurry.

[0034] The fourth step is to put the above slurry into the planetary degassing machine and rotate at 200rpm, rotate at 2000rpm for 15 minutes, and then the finished product can ...

Embodiment 3

[0037] In the first step, weigh 15% of resin, 1.4% of curing agent, 0.3% of accelerator, 2.8% of diluent, 0.29% of coupling agent, 0.25% of thixotropic agent, 0.4% of anti-sedimentation agent and conductive auxiliary agent in order according to parts by mass 0.3%, stir and disperse with a high-speed disperser for 20-60 minutes to obtain a resin mixture.

[0038] In the second step, a certain proportion of 79.26% silver powder is weighed, mixed with the above resin mixture, stirred and dispersed by a high-speed disperser for 20-60 minutes, and a uniform slurry is obtained.

[0039] In the third step, the prepared slurry is ground on a three-roll mill until the particle size distribution is less than 8 μm, and then passed through a 500-mesh polyester net to obtain a uniformly ground slurry.

[0040] The fourth step is to put the above slurry into the planetary degassing machine and rotate at 200rpm, rotate at 2000rpm for 15 minutes, and then the finished product can be obtained....

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Abstract

The invention discloses a solderable conductive silver paste capable of rapidly solidifying at low temperature and a preparation method thereof, The components of conductive silver paste include resin, curing agent, accelerator, diluent, coupling agent, thixotropic agent, anti-settling agent and conductive auxiliary agent, which can be solidified rapidly below 150DEG C, and can be directly bondedwith a variety of materials, thus greatly improving the construction efficiency of industrial application.

Description

technical field [0001] The invention relates to the technical field of conductive paste, in particular to a composition change of conductive silver paste and a method for preparing the conductive silver paste. Background technique [0002] As an important electronic material, conductive silver paste can be widely used in photovoltaic silicon cells, semiconductors, LED packaging, touch screens, membrane switches and other fields. It has the advantages of convenient construction, wide applicability, and environmental friendliness. [0003] Conductive silver paste is usually printed on the substrate by screen printing, letterpress printing, gravure printing, lithographic printing and flexographic printing, and then used after drying or sintering. It itself does not have solderability. With the development of technology, the solderability requirements of conductive silver paste are becoming more and more urgent in some emerging fields, such as photovoltaic field and artificial i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 石文马跃辉
Owner 善仁(浙江)新材料科技有限公司