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Halogen antimony-free resin composition, prepreg using same, laminated board and printed circuit board

A resin composition and prepreg technology, applied in laminates and printed circuit boards, halogen-free antimony resin compositions, and prepreg fields, can solve problems such as low correlation, and achieve breakthroughs in technical bottlenecks and good performance. The effect of flame retardancy

Active Publication Date: 2019-02-05
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this patent mainly involves the technical field of thermoplastics, and has little relevance to the technical field of copper clad laminates (thermosetting materials)

Method used

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  • Halogen antimony-free resin composition, prepreg using same, laminated board and printed circuit board
  • Halogen antimony-free resin composition, prepreg using same, laminated board and printed circuit board
  • Halogen antimony-free resin composition, prepreg using same, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8 and comparative example 1～11

[0060] The specific components and component contents (in parts by weight) of the resin compositions of Examples 1-8 and Comparative Examples 1-11 are shown in Table 1 and Table 2.

[0061] Concrete components and component content of the resin composition of table 1 embodiment 1~8

[0062]

[0063] Concrete components and component contents of the resin compositions of Table 2 Comparative Examples 1 to 11

[0064]

[0065]

[0066] Each component code and its corresponding component name in Table 1 and Table 2 are as follows:

[0067] A Flame-retardant epoxy resin: Among them, the weight ratio of phosphorus-containing epoxy resin, brominated epoxy resin and nitrogen-containing epoxy resin in A-1~A-3 is (1.3:1.5:1); A-8 The weight ratio in A-9 is (1.5:1.75:1.2); the weight ratio in A-9 is (1.4:1.6:1.1); the weight ratio in A-10 is (0.8:2.5:0.5);

[0068] A-1: A combination of DOPO-based epoxy resin with a phosphorus content of 3%, BPA epoxy resin with a bromine cont...

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Abstract

The invention provides a halogen antimony-free resin composition, a prepreg using the same, a laminated board and a printed circuit board. The halogen antimony-free resin composition comprises the following components in parts by weight: 25 to 70 parts of flame-retardant epoxy resin, 10 to 40 parts of non-flame-retardant epoxy resin, 20 to 60 parts of a curing agent, and 0.05 to 1.0 part of a curing accelerant; and the flame-retardant epoxy resin comprises a composition of phosphorus-comprising epoxy resin, bromination epoxy resin and nitrogen-comprising epoxy resin. By virtue of the cooperation of the flame-retardant epoxy resin and non-flame-retardant epoxy resin, especially the cooperation of three flame-retardant epoxy resin, a phosphorus-bromine-nitrogen synergistic flame-retardant effect can be achieved, a CEM-1 copper-coated laminated board is good in flame retardant property, the technical bottle neck that the halogen antimony synergistic flame-retardant system in the traditional halogen CEM-1 copper-coated laminated board cannot be replaced is broken through, and the halogen antimony-free resin composition has the advantages of significant comprehensive performance such ashigh heat resistance, high damp heat resistance and the like.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a halogen-containing antimony-free resin composition, a prepreg using the same, a laminated board and a printed circuit board. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CE...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/22C08J5/24B32B15/20B32B15/12B32B29/06H05K1/03
CPCB32B15/12B32B15/20B32B29/06B32B2260/028B32B2260/046B32B2307/3065B32B2457/08C08J5/24C08J2363/00C08J2463/00C08K2003/2224C08L63/00H05K1/0353C08K3/22
Inventor 张龙霍国洋李莎
Owner SHAANXI SHENGYI TECH
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