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Graphite composite circuit board

A composite circuit and composite substrate technology, applied in circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of copper foil layer falling off, easy peeling, low peeling strength, etc. Effect

Pending Publication Date: 2019-02-05
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this solution has obvious disadvantages: the insulating glue is only distributed between the copper foil layer of the flexible graphite layer or the substrate layer, and because the interlayer bonding force in the graphite layer is weak and easy to peel off, the copper clad laminate system The peel strength is very low, and the copper foil layer is easy to fall off

Method used

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  • Graphite composite circuit board
  • Graphite composite circuit board
  • Graphite composite circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] refer to figure 1 The graphite composite circuit board 1 comprises a substrate layer 11, a graphite composite layer 12 and a metal foil layer 13, and the graphite composite layer 12 bonds the substrate layer 11 and the metal foil layer 13 together.

[0025] According to different applications, the thickness of the substrate layer 11 is 10-9000 μm, and the material can be a metal substrate, a metal composite substrate, a ceramic substrate, a carbon substrate, a polymer substrate or a polymer composite substrate. in:

[0026] The metal substrate can be a pure metal plate or a metal alloy plate, such as aluminum plate, copper plate, aluminum alloy plate, copper alloy plate, titanium alloy plate, nickel alloy plate, stainless steel plate, etc.;

[0027] Metal composite substrates can be metal / ceramic composite boards, metal / diamond composite boards or metal / graphite composite boards, such as aluminum / ceramic powder composite boards, aluminum / diamond composite boards, alumi...

Embodiment 2

[0038] refer to image 3 , The graphite composite circuit board 3 comprises a substrate layer 31, two metal foil layers 33 and 33', and two graphite composite layers 32 and 32'. Metal foil layers 33, 33' are bonded to substrate layer 31 through graphite composite layers 32, 32' respectively. The substrate contains two metal foil layers and can be used as a two-layer circuit board.

[0039] In addition, the graphite composite circuit board of the present invention can be further expanded into a multilayer circuit board structure, such as Figure 4 As shown, the graphite composite circuit board 4 includes two substrate layers 411, 412, three metal foil layers 431, 432, 433, and graphite composite layers 421, 422, 423 or 424 are passed between adjacent substrate layers and metal foil layers. Bonded together to form a three-layer circuit board structure. Increase the number of substrate layers, metal foil layers and graphite composite layers, so that adjacent substrate layers a...

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Abstract

The invention discloses a graphite composite circuit board. The circuit board includes a substrate, a tinsel layer and a graphite composite layer; the graphite composite layer includes a graphite filmand a thermal conductive insulating adhesive; the graphite film contains through holes; the thermal conductive insulating adhesive wraps the graphite film and is put in the through holes; and the graphite composite layer is located between the substrate and the tinsel layer. Compared with the prior art, the circuit board is higher in bonding intensity and stronger in integral heat dissipation capability.

Description

technical field [0001] The invention relates to the field of thermally conductive circuit boards, in particular to a graphite composite circuit board. Background technique [0002] With the rapid development of electronic technology, the volume of electronic components is shrinking, the integration of chips is increasing, and the heat flux is also increasing. High-power electronic components will generate a lot of heat. If effective thermal management measures are not taken to transfer the heat away, the components will be damaged or even damaged. Graphite is a good thermal conductivity material with layered structure and anisotropy, and its plane thermal conductivity can reach 150-1800W / (m·K). Moreover, the density of graphite is low, the theoretical density is about 2.2g / cm 3 , is a thermally conductive material with broad application prospects. The graphite film or graphite sheet developed in recent years can be as thin as tens of microns, and has good flexibility, low...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/03
CPCH05K1/0203H05K1/036H05K2201/0195H05K2201/06
Inventor 王华涛王一杰武建锋马梓媛钟博胡小冬
Owner HARBIN INST OF TECH AT WEIHAI
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