High-temperature electron glass packaging material
A glass encapsulation and glass encapsulation technology, applied in the field of high-temperature electronic glass encapsulation materials, can solve problems such as affecting electrical properties, and achieve the effects of improving high-temperature wettability, preventing secondary crystallization, and improving flexural strength
Inactive Publication Date: 2019-02-15
SHAANXI AVIATION ELECTRICAL
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Problems solved by technology
Currently commonly used DM-308 has good fluidity at 800°C, not only cannot provide stable electronic glass packaging capabilities between the ceramic insulator substrate of the ignition tip and the Kovar electrode, but also due to the influence of capillary action , forming a DM-308 transition layer on the surface of Kovar alloy, which affects the electrical properties
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Embodiment Construction
[0021] Embodiments of the present invention are described in detail below, and the embodiments are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.
[0022] The technical idea of the present invention is to introduce metal oxide particles into the DM-308 electronic glass sealing material to achieve the purpose of strengthening and toughening the electronic glass.
[0023] The chemical composition of typical commercially available DM-308 electronic sealing glass is shown in Table 2:
[0024] Table 2 Chemical composition of commercially available DM-308 electronic sealing glass
[0025]
[0026] Add 3-6wt% Cr in the commercially available DM-308 in Table 2 2 o 3 , 3~5wt%Ni 2 o 3 , 0.5-3wt% MnO.
[0027] The purpose and effect of adding metal oxides:
[0028] Cr 2 o 3 :
[0029] Cr 2 o 3 In the glass phase of glass-ceramics, Cr 3+ with Cr 6+ Ions coexist, but with Cr 3+ Mainly, chromium ion ...
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Abstract
The invention discloses a high-temperature electron glass packaging material. Cr2O3, Ni2O3 and MnO2 are put into a DM-308 electron glass packaging material, Cr2O3 accounts for 3-6% of the total mass of a mixed material, Ni2O3 accounts for 3-5% of the total mass of the mixed material, and MnO2 accounts for 0.5-3% of the total mass of the mixed material. By adopting the material, the bending strength and the packaging temperature of an electron glass packaging material can be increased, secondary crystallization of vitreous humor can be prevented, the high-temperature wettability of the electronglass packaging material with an alloy can be improved, diffusion of metallic elements in the alloy at an interface into glass can be accelerated, and packaging properties can be improved.
Description
technical field [0001] The invention relates to an inorganic non-metallic material, in particular to a high-temperature electronic glass packaging material. Background technique [0002] Sealing materials can be roughly divided into three categories: organic materials, inorganic materials and metal materials in terms of chemical composition. Among them, organic materials include epoxy resin, silicone rubber, silicone resin and other polymer materials, which are mainly used for low temperature sealing; inorganic materials mainly include glass, enamel, etc., which are mainly used for high temperature and airtight sealing; metal materials Mainly Pb-Sn solder, etc., mainly used for soldering in electronic products. As a kind of sealing material, glass-based materials are superior to organic polymer materials in terms of air tightness and heat resistance, and are superior to metal materials in terms of insulation. Therefore, it can be used in vacuum electronic technology, laser...
Claims
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IPC IPC(8): C03C8/24
CPCC03C8/24
Inventor 乌凯杨爱梅师艳艳党腾华杨水银
Owner SHAANXI AVIATION ELECTRICAL