Environment-friendly anti-static electronic wafer protective film and preparation method thereof

An antistatic and environmentally friendly technology, used in static electricity, electrical components, conductive adhesives, etc., can solve the problem of high temperature resistance, achieve the effect of good initial focus, reduce loss costs, and reduce the discharge of defective products
CN109337616AInactive Publication Date: 2019-02-15深圳深汕特别合作区昌茂粘胶新材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
深圳深汕特别合作区昌茂粘胶新材料有限公司
Publication Date
2019-02-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides an environment-friendly anti-static electronic wafer protective film. The environment-friendly anti-static electronic wafer protective film comprises a polyurethane film and a glue layer; the raw materials of the glue layer comprise an acrylic pressure-sensitive adhesive and an ionic compound liquid; the ionic compound liquid contains an ionic liquid containing imidazole functional groups and LiTFSi; the adding amount of the ionic compound liquid is 0.5-2 % of the acrylic pressure-sensitive adhesive according to the mass percentage; and the mass ratio of the ionic liquidcontaining the imidazole functional groups to the LiTFSi is 60-65:35-40. The environment-friendly anti-static electronic wafer protective film provided by the invention has the advantages of better anti-static performance, high adhesion force, no residue and appropriate adhesion force.
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Description

technical field

[0001] The invention belongs to the field of film materials, and in particular relates to an environment-friendly antistatic electronic wafer protection film and a preparation method thereof. Background technique

[0002] Consumers' demand for various digital products is changing with each passing day, and various protective films are also produced in parts, and there are more and more structural labels, and the requirements for various antistatic and degumming are gradually increasing. At the same time, the residues of various odors and chemicals are becoming more and more strict.

[0003] Ordinary water-based emulsions and labels will have the problem of not being able to withstand high temperatures, especially double-sided adhesive tape for flannelette labels, many of which are pasted with solvent-based glue or super glue. By modifying the glue, the invention can achieve good temperature resistance, no residue, environmental protection and antistatic prop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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