High-performance and high-compactness power module

A power module and compact technology, which is applied in the field of high-performance and high-compact power modules, can solve the problems of low system compactness, low system compactness, and general module electrical performance, so as to reduce busbar stray Inductance, the effect of improving the operating current of the module and improving the electrical performance of the module
CN109347340APending Publication Date: 2019-02-15BINZHOU UNIV
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
BINZHOU UNIV
Publication Date
2019-02-15

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Abstract

The invention relates to the field of power semiconductor and power module application, in particular to a high-performance and high-compactness power module. The power module comprises a plastic shell on which a copper bar is formed by injection molding; a current sensor, an insulation substrate and a heat dissipation bottom plate are fixed in the shell; the bottom of the copper bar is combined with a front copper-clad layer of the insulation substrate in an ultrasonic bonding or welding connection mode; and a back copper-clad layer of the insulation substrate is combined with the heat dissipation bottom plate in a welding mode. According to the high-performance and high-compactness power module, the compactness of system application is achieved by integrating the plastic shell with the current sensor; a heat dissipation structure with fin pins is adopted to increase an operation current of the module, thereby improving the electric performance of the module; the compactness and miniaturization design of the power module is realized by adopting internal three-dimensional and laminated busbar arrangement; and meanwhile, the stray inductance of a busbar is reduced through a laminated busbar structure, so that an operation voltage of the power module is increased, and the electric performance of the module is improved.
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Description

(1) Technical field

[0001] The invention relates to the field of application of power semiconductors and power modules, in particular to a high-performance and high-compact power module. (2) Background technology

[0002] Facing the increasingly depleted oil resources and the huge pressure of environmental protection, new energy vehicles have shown great advantages and broad development prospects.

[0003] The rapid development of new energy vehicles has driven the rapid application of vehicle inverters. The key core component in the vehicle inverter is the power module, which realizes electric power conversion through switching action, converts DC to AC, or converts AC to DC.

[0004] Power modules in automotive inverters have high performance and high compactness requirements. High performance requires that the power module can operate at a higher voltage or current, and high compactness requires the power module to be as small as possible to improve the power density an...

Claims

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