High-performance and high-compactness power module

Abstract

The invention relates to the field of power semiconductor and power module application, in particular to a high-performance and high-compactness power module. The power module comprises a plastic shell on which a copper bar is formed by injection molding; a current sensor, an insulation substrate and a heat dissipation bottom plate are fixed in the shell; the bottom of the copper bar is combined with a front copper-clad layer of the insulation substrate in an ultrasonic bonding or welding connection mode; and a back copper-clad layer of the insulation substrate is combined with the heat dissipation bottom plate in a welding mode. According to the high-performance and high-compactness power module, the compactness of system application is achieved by integrating the plastic shell with the current sensor; a heat dissipation structure with fin pins is adopted to increase an operation current of the module, thereby improving the electric performance of the module; the compactness and miniaturization design of the power module is realized by adopting internal three-dimensional and laminated busbar arrangement; and meanwhile, the stray inductance of a busbar is reduced through a laminated busbar structure, so that an operation voltage of the power module is increased, and the electric performance of the module is improved.

Description

(1) Technical field [0001] The invention relates to the field of application of power semiconductors and power modules, in particular to a high-performance and high-compact power module. (2) Background technology [0002] Facing the increasingly depleted oil resources and the huge pressure of environmental protection, new energy vehicles have shown great advantages and broad development prospects. [0003] The rapid development of new energy vehicles has driven the rapid application of vehicle inverters. The key core component in the vehicle inverter is the power module, which realizes electric power conversion through switching action, converts DC to AC, or converts AC to DC. [0004] Power modules in automotive inverters have high performance and high compactness requirements. High performance requires that the power module can operate at a higher voltage or current, and high compactness requires the power module to be as small as possible to improve the power density an...

AI Technical Summary

Problems solved by technology

[0006] Patent Document 1 (Application No.: 200510076308.5; Invention Name: Power Stack) describes an IGBT power module structure with integrated cooling. The module uses a double-sided indirect water-cooled IGBT power module. Only when the cooling surface is completely covered can the cooling of the module be realized. Although the module of this structure is small, the volume of the stacked cooler of the cooling module is relatively large, resulting in a low compactness of the application system. This structure mainly improves the module by enhancing heat dissipation. operating current, but has little effect on increasing the operating voltage

[0007] Patent Document 2 (Application No.: 201310240571.8; Invention Name: Power Conversion Device, Power Module, and Vehicle Power Conversion Device) describes a power module and a power conversion device using the power module. Surface-direct water-cooled IGBT power module, the module is immersed in a cooling cavity with a cylindrical cooling groove, the height of this radiator depends on the height of the module, so it is much larger than the cooler with single-side indirect water cooling or single-side direct water cooling , which directly leads to the larger size of the application system and the low compactness of the system. This structure mainly increases the operating current of the module through enhanced heat dissipation, but has little effect on increasing the operating voltage.

[0008] Patent Document 3 (Application No.: 201210069142.4; Invention Name: Power Module) describes a power module device, which uses a single-sided direct water-cooled IGBT power module, and the module is attached to the surface of the radiator. The heat dissipation effect of this heat dissipation method is Poor, so much larger than single-sided direct water-cooled or double-sided indirect / direct water-cooled coolers, which directly leads to a larger application system size, low system compactness, poor heat dissipation, and general electrical performance of the module

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