Circuit board with electromagnetic shielding function, and manufacturing method of circuit board

Abstract

Disclosed is a manufacturing method of a circuit board with an electromagnetic shielding function. The manufacturing method comprises the following steps that a single-sided copper-clad substrate is provided, wherein the single-sided copper-clad substrate comprises a first base material layer and a first copper foil layer; the first base material layer comprises a first surface and a second surface opposite to the first surface, and the first copper foil layer is formed on the first surface; a first low-loss dielectric layer is formed on the second surface; at least one first containing hole which penetrates through the first low-loss dielectric layer and the first base material layer is formed, and a first conductive paste is filled in the first containing hole, so as to form a first electromagnetic shielding layer; and a circuit substrate is provided, and the first electromagnetic shielding layer is pressed on the circuit substrate, wherein the circuit substrate comprises a first conductive circuit layer, and the first conductive paste is directly electrically connected with the first conductive circuit layer and the first copper foil layer. The invention further relates to the circuit board with the electromagnetic shielding function.

Description

technical field [0001] The invention relates to the field of electromagnetic shielding manufacturing, in particular to a circuit board with electromagnetic shielding function and a manufacturing method thereof. Background technique [0002] When common electronic equipment is working, because of the intermittent or continuous change of the working voltage and current, the internal electronic components will often cause electromagnetic radiation energy of a certain frequency, which will radiate to the surrounding environment and cause damage to the adjacent electronic components. interference, or even cause the adjacent electronic components to fail to work properly. Moreover, as mid-to-high-end consumer electronics products have higher quality requirements, their requirements for electromagnetic shielding are also getting higher and higher. [0003] Common electronic equipment implements electromagnetic shielding by adding a shielding cover locally on the circuit board. Spe...

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Problems solved by technology

[0004] However, the circuit board with an electromagnetic shielding film attached to the outer layer of the circuit board to prevent electromagnetic radiation is complicated and thick.

[0005] On the outer layer of the circuit board, an aluminum substrate is attached to prevent electromagnetic radiation. The grounding part of the circuit board is directly opened by laser and filled with conductive paste to complete the grounding. Prone to gaps and therefore less effective shielding

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