Method for manufacturing magnesium alloy-stainless steel composite board

A technology of magnesium alloy plate and stainless steel, which is applied in the direction of manufacturing tools, welding equipment, arc welding equipment, etc., can solve problems such as constraints, and achieve the effect of solving easy oxidation

Active Publication Date: 2019-03-12
JILIN UNIV
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Problems solved by technology

[0004] The object of the present invention is to propose a method for preparing a magnesium alloy-stainless steel clad plate, which is difficult to form a magnesium alloy-stainless steel clad plate wi

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  • Method for manufacturing magnesium alloy-stainless steel composite board
  • Method for manufacturing magnesium alloy-stainless steel composite board

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Embodiment 1

[0023] The implementation of the preparation of the magnesium alloy-stainless steel composite plate will be described in detail below in conjunction with the accompanying drawings. The thickness of the magnesium alloy plate 3 is 2 mm, and the thickness of the stainless steel upper plate 2 and the stainless steel lower plate 5 is 0.5 mm. The grade of the selected magnesium alloy plate is AZ31, and the grade of the stainless steel plate is 06Cr19Ni10.

[0024] Step (1): Firstly, the surfaces of the magnesium alloy plate 3 , the stainless steel upper plate 2 , the stainless steel lower plate 5 and the stainless steel sealing frame 4 need to be pretreated to remove organic impurities and surface oxides. The detailed process is as follows: first, use ethanol to clean the oil stains on the surface of the magnesium alloy plate and stainless steel plate to be composited, and rinse with water; wash with 20wt% NaOH aqueous solution for 3 minutes, and rinse with 10wt% HNO 3 The solution...

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Abstract

The invention discloses a method for manufacturing a magnesium alloy-stainless steel composite board, which belongs to the field of metal composite board processing and aims to solve the problem thatapplication, in the industrial field, of the magnesium alloy-stainless steel composite board with relatively good interface connection, which is difficulty formed by an existing forming method, is restrained. A packaging and sealing structure can be adopted to effectively solve the problem that oxidization is easily caused in a magnesium alloy heating process, so that inert gas does not need to additionally apply in a heating process for protection; a silver-coated layer of a to-be-combined surface can be taken as a transition element to improve wettability, on a stainless steel surface, of amagnesium alloy, so that metallurgical bonding of the combined surface is promoted; the temperature of a heating furnace exceeds a melting point of the magnesium alloy, and the magnesium alloy is quickly discharged out of the furnace for being quickly cooled after heat is preserved, so that magnesium alloy melt has sufficient contact time with the stainless steel surface, and therefore, diffusionof the interface element is facilitated; besides, the packaging sealing structure further can prevent the magnesium alloy melt from being heated to expand, so that pressure does not need to additionally apply through the method, relatively great stress is generated on the combined interface, and diffusion connection of the combined interface is promoted.

Description

technical field [0001] The invention belongs to the field of metal composite plate processing, and in particular relates to a method for preparing a magnesium alloy-stainless steel composite plate. Background technique [0002] In today's world, with the rapid development of science and technology and the continuous emergence of new industries and technologies, the manufacturing industry is constantly developing towards lightweight and high-performance products. As the lightest metal material that can be used in engineering in the world today, magnesium alloy has the characteristics of high specific strength and specific stiffness. At the same time, it has excellent thermal conductivity, electrical conductivity and electromagnetic shielding performance, and has great advantages in shock resistance and noise reduction. , has broad application prospects in the fields of automobiles, communication electronics, etc. The hexagonal close-packed structure of magnesium itself leads...

Claims

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Application Information

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IPC IPC(8): C23G1/19C23G1/22C25D3/46C21D8/02B23K9/167
CPCB23K9/167C21D8/0226C23G1/19C23G1/22C25D3/46
Inventor 宋家旺吴文豪管志平马品奎任明文
Owner JILIN UNIV
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