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Compound microorganism bacterium agent for treating electroplating wastewater and preparation and application methods

A technology of composite microbial agent and electroplating wastewater, applied in the direction of microorganism-based methods, biochemical equipment and methods, metallurgical wastewater treatment, etc., can solve the problems of difficult long-term stable operation of the biochemical section and the impact of the biochemical section, and achieve low cost, Good system stability

Active Publication Date: 2019-03-19
重庆融极环保工程有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At present, after the physical and chemical treatment of electroplating wastewater in the early stage, although the content of heavy metals has been greatly reduced, it still has a great impact on the biochemical section, and it is difficult for the biochemical section to operate stably for a long time

Method used

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  • Compound microorganism bacterium agent for treating electroplating wastewater and preparation and application methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A compound microbial bacterial agent for electroplating wastewater treatment, the compound microbial bacterial agent is prepared according to the following volume ratio:

[0036] Bacillus subtilis 15%;

[0037] Bacillus licheniformis 15%;

[0038] Bacillus amyloliquefaciens subsp. 15%;

[0039] Bacillus amyloliquefaciens 15%;

[0040] Bacillus 10%;

[0041] Yeast 10%;

[0042] Bacillus cereus 10%;

[0043] Klebsiella 5%;

[0044] Acinetobacter baumannii 5%.

Embodiment 2

[0046] A compound microbial bacterial agent for electroplating wastewater treatment, the compound microbial bacterial agent is prepared according to the following volume ratio:

[0047] Bacillus subtilis 12%;

[0048] Bacillus licheniformis 12%;

[0049] Bacillus amyloliquefaciens subsp. 12%;

[0050] Bacillus amyloliquefaciens 12%;

[0051] Bacillus 12%;

[0052] Yeast 12%;

[0053] Bacillus cereus 12%;

[0054] Klebsiella 8%;

[0055] Acinetobacter baumannii 8%.

Embodiment 3

[0057] A compound microbial bacterial agent for electroplating wastewater treatment, the compound microbial bacterial agent is prepared according to the following volume ratio:

[0058] Bacillus subtilis 10%;

[0059] Bacillus licheniformis 10%;

[0060] Bacillus amyloliquefaciens subsp. 10%;

[0061] Bacillus amyloliquefaciens 10%;

[0062] Bacillus 15%;

[0063]Yeast 15%;

[0064] Bacillus cereus 15%;

[0065] Klebsiella 5%;

[0066] Acinetobacter baumannii 10%.

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Abstract

The invention discloses a compound microorganism bacterium agent for treating electroplating wastewater and preparation and application methods. The method comprises the following steps: (1) uniformlymixing bacillus subtilis, bacillus licheniformis, bacillus amyloliquefaciens subspecies, bacillus amyloliquefaciens, bacillus, saccharomycetes, bacillus cereus, klebull crapiella and acinetobacter baumannii in a volume ratio to prepare a compound bacterium agent; (2) continuously introducing electroplating wastewater subjected to physicochemical treatment into a biochemical tank; and adding the bacterium agent in step (1) into the biochemical tank for biochemical reaction, wherein the addition of the bacterium agent is 0.05 to 0.5 percent of the effective volume of the biochemical tank. The compound microorganism bacterium agent can be used for effectively reducing COD (Chemical Oxygen Demand) and nitrogen ammonia in the electroplating wastewater and the problem that the electroplating wastewater biochemical tank is easy to collapse is solved; the treatment efficiency is improved; and meanwhile, the compound microorganism bacterium agent also has the advantages of low cost, no pollution, no toxicity, high efficiency and easiness for implementation and the like.

Description

technical field [0001] The invention belongs to the technical field of electroplating wastewater treatment, and in particular relates to a composite microbial bacterial agent for electroplating wastewater treatment and a preparation and use method. Background technique [0002] Electroplating is a process in which the plated parts undergo chemical or electrochemical reactions in the plating tank to obtain a metal protective layer. The main source of electroplating wastewater is the cleaning water of the plating parts, the filtering water of the plating parts, the waste plating solution and the "running, running, dripping and leaking" caused by improper operation or poor management in the electroplating production process; in addition, there are wastewater treatment processes Discharge of self-owned water and drainage of laboratory tests. Electroplating wastewater mainly contains heavy metal ions such as chromium, zinc, copper, cadmium, lead, nickel, etc., as well as acids a...

Claims

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Application Information

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IPC IPC(8): C12N1/20C12N1/16C02F3/34C12R1/125C12R1/10C12R1/07C12R1/645C12R1/085C12R1/22C12R1/01C02F103/16
CPCC12N1/16C12N1/20C02F3/34C02F3/347C02F3/348C02F2103/16
Inventor 李大荣杨平贾春燕燕艳
Owner 重庆融极环保工程有限公司