Automatically-monitoring temperature returning box for solder paste, and use method thereof

Abstract

The invention relates to an automatically-monitoring temperature returning box for a solder paste, and a use method thereof. The temperature returning box comprises a box body and a base, wherein thebox body is installed on the base; the box body comprises an upper computer, a programmable logic controller PLC, a system power supply and a temperature returning cabinet, and the upper computer is connected with the programmable logic controller; and a rotary door is formed in the front end of the temperature returning cabinet, an electromagnetic lock is arranged on the temperature returning cabinet, and the electromagnetic lock is connected with the programmable logic controller, and controls opening and locking for the rotary door. The use method is simple to operate, high in automation degree, intelligent in control, and high in control accuracy; according to the automatically-monitoring temperature returning box for the solder paste, and the use method thereof, the defects that a temperature returning time for the existing solder paste is difficultly grasped, the labor cost is high, and insufficient soldering is easily caused due to abnormal temperature returning are overcome, the starting time and the ending time of temperature returning do not need to be manually recorded by personnel, so that waste for labor and working hours is avoided, and the working efficiency is increased; and the temperature returning time can be accurately and automatically controlled, an alarming prompt function is achieved, and then the product quality is improved.

Description

technical field [0001] The invention relates to the technical field of temperature recovery devices, in particular to an automatic monitoring type solder paste temperature recovery box and a use method thereof. Background technique [0002] Surface mount technology (SMT) is the most commonly used process technology in the electronic packaging industry at present. It is a technology that uses solder paste to solder electronic components on circuit boards. The quality of solder paste will affect the relationship between electronic components and circuit boards. The quality of the electrical connection between them is therefore valued. Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. [0003] Solder paste needs to be refrigerated when stored, and it needs to be warmed up before use. Generally, the storage temperature of solder paste is about 5°C. It ...

AI Technical Summary

Problems solved by technology

Since the solder paste is scattered and placed, the visualization is not clear. When the staff takes the solder paste, the recovery time of the solder paste is not the longest and the recovery time is normal, which will easily lead to the longest recovery time. The solder paste continues to warm up, and when the solder paste is taken again, the solder paste with the longest warm-up time may take too long, that is, the warm-up time is abnormal; or when taking the solder paste, there is a human error of the staff , the temperature recovery time of the solder paste taken is short, less than 4 hours, that is, the temperature recovery time of the solder paste is abnormal

[0005] In the prior art, the controllability of the temperature return time of the solder paste is poor, and it is easy to cause abnormal temperature return of the solder paste, that is, the temperature return of the solder paste is insufficient or the time is too long, and the solder paste with an abnormal return temperature is used for reflow soldering During welding, it is easy to cause welding defects and affect the quality of components. Solder paste cannot be guaranteed to achieve the effect of returning to temperature before use, causing quality problems

[0006] Chinese patent CN206263405U discloses a solder paste warming device, including a warming box, a first label, a warming channel, a chute, a sliding block, etc.; the right side of the warming box is evenly opened with openings from top to bottom, The front side of the placement port is bonded with the first label, and the left side of the reheating box is uniformly opened from top to bottom. When processing, the staff can write the corresponding storage time and take-up time on the first label and the second label; this invention requires the staff to fill in the reheating time and check the label immediately to judge whether the reheating time of the solder paste is normal. It is easy to miss the proper temperature recovery time, resulting in abnormal solder paste temperature recovery time and affecting product quality

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