4H-SiC metal semiconductor field effect transistor with lightly doped gate edge drain side portion
A field-effect transistor and metal-semiconductor technology, applied in the field of 4H-SiC metal-semiconductor field-effect transistors, can solve the problems of easy breakdown of the device, limit the working environment and reliability of the device, and influence on its life, and reduce the carrier concentration. , The effect of alleviating the charging effect and improving the lifespan
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[0017] Example 1
[0018] Such as figure 1 As shown, the lightly doped 4H-SiC metal semiconductor field effect transistor with the drain side part of the gate edge provided by this embodiment includes a 4H-SiC semi-insulating substrate 1, a P-type buffer layer 2, and an N-type trench from bottom to top. The upper surface of the channel layer 3 and the N-type channel layer 3 are provided with a source cap layer 4 and a drain cap layer 5 on both sides. The source electrode 6 is provided on the upper surface of the source cap layer 4, and the drain cap layer 5 is A drain electrode 7 is provided on the surface, a gate electrode 8 is provided at the bottom of the N-type channel layer 3 and on the side close to the source cap layer 4, at the bottom of the N-type channel layer 3 and located under the gate of part of the gate electrode 8 and part of the gate. A lightly doped region 9 is formed between the drains, and the lightly doped region 9 has an axisymmetric structure with the vert...
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