1results about How to "Suppress breakdown" patented technology

The high-frequency dielectric heating adhesive (1A) of the present invention contains a thermoplastic resin (A) and a dielectric filler (B). When the cross-section of the high-frequency dielectric heating adhesive (1A) cut along the thickness direction is observed by scanning electron microscopy, the relationship between the nearest centroid distance Dg of the dielectric filler (B) and the particle size Dn of the dielectric filler (B) satisfies the following mathematical formula (F1): 1.55≤Dg / Dn≤1.85 ···(F1).