2results about How to "Suppress breakdown" patented technology

The high-frequency dielectric heating adhesive (1A) of the present invention contains a thermoplastic resin (A) and a dielectric filler (B). When the cross-section of the high-frequency dielectric heating adhesive (1A) cut along the thickness direction is observed by scanning electron microscopy, the relationship between the nearest centroid distance Dg of the dielectric filler (B) and the particle size Dn of the dielectric filler (B) satisfies the following mathematical formula (F1): 1.55≤Dg / Dn≤1.85 ···(F1).

The utility model relates to the technical field of power electronic silicon stack devices, in particular to a silicon carbide patch type ceramic diode. Comprising a ceramic shell, a silicon carbide chip, a lead-in electrode, a lead-out electrode, a copper-clad substrate and a bonding copper sheet, the silicon carbide chips are fixedly connected to the copper-clad substrates, the multiple copper-clad substrates are distributed in a matrix mode, the ceramic shell is of a rectangular box structure with an opening, grooves corresponding to the copper-clad substrates are formed in the inner bottom face of the ceramic shell, and the copper-clad substrates are embedded into the grooves. The leading-in electrode and the leading-out electrode are fixedly connected to the two sides of the copper-clad substrate matrix and connected with the copper-clad substrate and the silicon carbide chip through the bonding copper sheets. And the copper-clad substrates are connected through bonding copper sheets. The heat conductivity can be improved, the packaging process is simplified, and the overall performance is improved.