A method of laser processing chip

Abstract

The invention provides a chip laser processing method. The method comprises the steps that an angle-adjustable workbench is constructed, and a refrigeration type infrared detection chip to be processed is placed on the workbench; adjusting and compensating technological parameters of the workbench and laser parameters of a laser processing system constructed by a laser device and an optical element are set; according to the laser parameters and the adjusting and compensating technological parameters, the angle of the workbench is adjusted at least one time, and therefore the laser processing system carries out inclined processing on the portion between a picture element layer and the edge of the refrigeration type infrared detection chip so as to form an edge small-included-angle shallow groove. The groove type structure of the prepared groove can be improved, the groove heat effect area produced in the laser processing process is effectively controlled, the performance of the refrigeration type infrared detection chip is further optimized, and the preparation yield is improved.

Description

technical field [0001] The invention relates to the technical field of laser micromachining, in particular to a method for laser machining chips. Background technique [0002] Infrared detectors have been well used in both civil and military applications, and the performance of cooled infrared detectors is particularly excellent. The infrared detection chip in the cooling type infrared detector is often in an environment with drastic temperature changes. In order to ensure its normal working performance, the infrared detection chip in the detector needs to be cooled with liquid nitrogen during the working state. The temperature at this time is about It is -200°C, but during non-working hours, the infrared detection chip is exposed to the atmospheric temperature. For example, the highest temperature in the desert can sometimes reach about 70°C, so the ambient temperature of the infrared detection chip is between -200°C and Constantly changing between 70°C. [0003] The stru...

AI Technical Summary

Problems solved by technology

The advantages of this method: simple operation, low equipment requirements, and good etching selectivity; disadvantages: first, a photolithography process is required for each chip, which is time-consuming and laborious; Liquid, complex corrosion process, low precision, easy to damage the bottom readout circuit

The advantages of dry etching: the first etching selectivity and anisotropy are good, the second etching pattern can be precisely controlled and the resolution is high; the disadvantages: first, a single chip needs to be photolithography, which is time-consuming and laborious, and the second is damage Bottom readout circuit

These methods are expensive to prepare, require a special optical module, and the system is complex, using multiple optical devices, the system adjustment is difficult, and any deviation will lead to a deviation in the focus; one is to tilt the sample, but tilting the sample will cause the processing It is very inconvenient, and it is easy to cause defocusing in different positions

Most importantly, the existing tilting sample equipment can only be used for one-dimensional processing

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