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Adhesive for copper-clad plates suitable for automobiles, and preparation method thereof

A copper clad laminate and adhesive technology, applied in the direction of adhesive types, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the difficult production and processing of polyphenylene ether system and high product cost problem, to achieve the effect of good machinability, low water absorption, and reduced curing time

Inactive Publication Date: 2019-03-29
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This development route has good dielectric properties, but there are disadvantages such as high product cost and difficult production and processing of polyphenylene ether system

Method used

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  • Adhesive for copper-clad plates suitable for automobiles, and preparation method thereof
  • Adhesive for copper-clad plates suitable for automobiles, and preparation method thereof
  • Adhesive for copper-clad plates suitable for automobiles, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] 1. Prepare materials according to the formula composition

[0051] Material name

Example 1

Brominated modified epoxy resin (%)

35

Isocyanate-modified epoxy resin (%)

25

Novolac resin

35

Amine curing agent

5

2-Ethyl-4 methylimidazole

0.05

Inorganic filler (%)

20

Silane (%)

0.12

Organic solvents(%)

30

Toughening agent (%)

13

[0052] 2. Glue adjustment

[0053] 2.1 Add organic solvent, silane, and 2-ethyl-4-methylimidazole to the stirring tank in sequence according to the amount of the formula, turn on the high-speed stirrer at a speed of 1200 rpm, keep the temperature of the tank at 45°C, and continue stirring for 30 minutes after the addition is complete;

[0054] 2.2 Add brominated-modified epoxy resin, isocyanate-modified epoxy resin, novolac resin, and toughening agent in sequence according to the formula amount in the stirring tank and stir for 150 minutes at ...

Embodiment 2

[0071] 1. Prepare materials according to the formula composition

[0072] Material name

Example 2

Brominated modified epoxy resin (%)

15

Isocyanate-modified epoxy resin (%)

35

Novolac resin

49

Amine curing agent

1

2-Ethyl-4 methylimidazole

0.02

Inorganic filler (%)

50

Silane (%)

0.25

Organic solvents(%)

50

Toughening agent (%)

5

[0073] 2. Glue adjustment

[0074] 2.1 Add organic solvent, silane, and 2-ethyl-4-methylimidazole into the mixing tank in sequence according to the formula amount, turn on the high-speed stirrer, rotate at 1300 rpm, keep the tank temperature at 35°C, and continue stirring for 50 minutes after the addition is complete;

[0075] 2.2 Add brominated-modified epoxy resin, isocyanate-modified epoxy resin, novolac resin, and toughening agent in sequence according to the formula amount in the stirring tank and stir for 170 minutes at a speed of 1100 rp...

Embodiment 3

[0092] 1. Prepare materials according to the formula composition

[0093]

[0094]

[0095] 2. Glue adjustment

[0096] 2.1 Add organic solvent, silane, and 2-ethyl-4-methylimidazole to the stirring tank in sequence according to the formula amount, turn on the high-speed stirrer, rotate at 1100 rpm, keep the tank temperature at 30°C, and continue stirring for 70 minutes after the addition is complete;

[0097] 2.2 Add brominated-modified epoxy resin, isocyanate-modified epoxy resin, novolac resin, and toughening agent in sequence according to the formula amount in the stirring tank and stir for 120 minutes at a speed of 1400 rpm;

[0098] 2.3 Weigh the inorganic filler according to the formula, add it into the stirring tank and stir for 2 hours at a speed of 1300 rpm, and then the adhesive is prepared.

[0099] 3. Glue and bake

[0100] The adhesive made by impregnating 7628 type E-glass glass fiber cloth is selected, and the semi-cured adhesive sheet is prepared by gl...

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Abstract

The invention relates to an adhesive for copper-clad plates suitable for automobiles, and a preparation method thereof. The adhesive is prepared from, by weight, 30-70 parts of linear phenolic resin,10-60 parts of isocyanate modified epoxy resin, 10-60 parts of brominated modified epoxy resin, 0.5-10 parts of an amine curing agent, 0.01-0.10 part of 2-ethyl-4-methylimidazole, 0.1-1.5 parts of silane, 2-20 parts of a toughener, 20-70 parts of an organic solvent and 10-80 parts of an inorganic filler through two steps of material preparation and adhesive mixing. Compared with the prior art, thepreparation method can effectively improve material curing conditions, shorten the curing time and improve the reliability after curing by adopting a double-curing system and utilizing the synergistic curing of the phenolic curing agent and the amine curing agent according to a unique ratio.

Description

technical field [0001] The invention relates to the field of preparation of copper clad laminates, in particular to an adhesive for copper clad laminates suitable for automobiles and a preparation method thereof. Background technique [0002] With the development of modern electronic technology, more and more electronic technology is applied to automobiles, and there are more and more various electronic control units. From 2002 to 20013, the average growth rate of the global automotive electronics market was about 6.7%, while my country's automotive electronics industry was even higher, reaching 33.7% in 2015, and will maintain a high growth rate of around 30% before 2019. At present, the electronic products of sedan cars account for 30% to 40% of the cost of the whole vehicle, and the proportion of electronic products of trucks is 10% to 20%. [0003] The reliability and quality of the car is closely related to the life safety of the driver and occupant, and the failure of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J11/06C09J11/08C09J11/04C08J5/24
CPCC08J5/24C08J2361/06C08J2363/00C08J2461/06C08J2463/00C08K2201/014C08L2201/02C08L2201/08C08L2205/025C08L2205/035C08L2207/53C09J11/04C09J11/06C09J11/08C09J161/06C09J163/00C08L61/06C08L63/00C08K3/013C08K3/22C08K3/34
Inventor 孙世伟粟俊华席奎东
Owner NANYA NEW MATERIAL TECH CO LTD
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