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A method for manufacturing a semiconductor component for an electric mouthpiece

A manufacturing method and semiconductor technology, applied in electrical components, circuits, spark plugs, etc., can solve the problems of large energy loss and difficult processing, and achieve the effects of low energy loss, low processing difficulty, and reduced energy loss.

Active Publication Date: 2020-07-14
四川泛华航空仪表电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the technical problems of high processing difficulty and large energy loss in the semiconductor components used in the electric nozzle in the prior art

Method used

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  • A method for manufacturing a semiconductor component for an electric mouthpiece

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Embodiment 1

[0016] like figure 1 As shown in the figure, a method for manufacturing a semiconductor component for an electric nozzle described in this embodiment is characterized in that it includes the following steps: carbonizing the silicon carbide semiconductor 1, the sintered composite material 2, and the high-alumina ceramic 3 at room temperature by carbonization. The silicon semiconductor 1 is on the top, the sintered composite material 2 is in the middle, and the high-alumina ceramic 3 is on the bottom, and the preliminary molding is performed to form the component to be sintered; the component to be sintered is hot isostatic pressing at 1800 ℃ for two hours to make a semiconductor component. .

[0017] In this embodiment, by sintering the semiconductor and the insulator as a whole into a semiconductor component, it is avoided that the silicon carbide semiconductor 1 and the nozzle insulator need to be processed and connected when installing in the nozzle, which reduces the proces...

Embodiment 2

[0019] On the basis of the above-mentioned embodiments, the second embodiment is proposed, such as figure 1 As shown, it is characterized in that: in the semiconductor component, the thickness of the silicon carbide semiconductor 1 is not more than 5 mm.

[0020] By controlling the ratio of silicon carbide semiconductor 1, sintered composite material 2, and high-alumina ceramic 3, the thickness of the silicon nitride semiconductor can be made not more than 5mm, and the overall height of the semiconductor component can be filled by adjusting the thickness of the high-alumina ceramic 3. To meet the requirements of the nozzle for semiconductor components, it has good anti-corrosion ability, and at the same time, it can reduce the internal leakage current that may be generated, and further reduce the energy loss of the nozzle.

[0021] In this embodiment, the use ratio of the sintered composite material 2 is relatively flexible, and the sintered composite material 2 only needs to ...

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Abstract

The invention provides a method for manufacturing a semiconductor component for an electric nozzle, characterized in that the method includes the following steps: carrying out preliminary forming on asilicon carbide semiconductor (1), a sintered composite material (2) and alumina porcelain (3) at room temperature according to the combination order that the silicon carbide semiconductor (1) is located on the upper part, the sintered composite material (2) is located in the middle part, and the alumina porcelain (3) is located on the lower part, and further forming a to-be-sintered component; and sintering the to-be-sintered component by hot isostatic pressure at 1800DEG C for two hours to manufacture the semiconductor component. According to the scheme of the invention, a semiconductor andan insulator are integrally sintered into the semiconductor component, so that the processing difficulty is reduced; the sintered composite material (2) is added between the silicon carbide semiconductor (1) and the alumina porcelain (3), the thickness of the silicon carbide semiconductor (1) is reduced, and thus the energy loss is reduced; and the technical problem that the semiconductor component for the electric nozzle in the prior art has large processing difficulty and high energy loss can be solved.

Description

technical field [0001] The invention relates to a manufacturing method, in particular to a manufacturing method of a semiconductor component used for an electric nozzle. Background technique [0002] The nozzle is an important part of the aero-engine ignition system. Its function is to convert the high-voltage electrical energy pulse generated by the ignition device into an electric spark at its end to ignite the combustible gas mixture in the combustion chamber of the engine. At present, the nozzles used in aero-engines are roughly divided into the following four types: high-pressure air gap nozzles, electric erosion nozzles, creeping nozzles and semiconductor nozzles. [0003] The semiconductor component is an important part of the semiconductor nozzle. Its function is that under the applied voltage, the surface of the semiconductor component forms electrical conduction and a certain current is formed, which causes the surface heating temperature of the semiconductor compo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01T13/02F02C7/266
CPCF02C7/266H01T13/02
Inventor 李慧尚振杰刘涛刘宝林
Owner 四川泛华航空仪表电器有限公司
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