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Microfluidic chip and preparation process thereof

A microfluidic chip and preparation technology, applied in the field of experimental equipment, can solve the problems of high mold manufacturing cost, high viscosity of raw materials, low efficiency, etc., and achieve the effects of high production efficiency, high chip quality, and high degree of molding

Inactive Publication Date: 2019-04-12
贵州中科金玖生物技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The existing PDMS reprinting technology has some disadvantages, such as: mold manufacturing cost is high, not durable, and some structural templates with large aspect ratio and narrow spacing are difficult to process, and molds processed by commonly used photolithography processing methods are easily damaged , not conducive to industrial application
Secondly, the PDMS reprinting technology has low efficiency and low output, and is only suitable for scientific research in laboratories or occasions with small demand for dosage.
[0007] And the reprinted PDMS film is elastic because the material of PDMS itself is high, the viscosity of the raw material is high, and the fluidity is not very good. For the PDMS chip with complex and dense flow channels, the structural shape after molding is not very regular.
[0008] Due to the chemical inertness of the PDMS film, it is not easy to bond with other materials. Using plasma and some special surface modification methods can only make it bond with other PDMS films, glass, silicon and other few materials.
There are also some technologies that first modify the surface of the PDMS membrane chip, and then bond it with 502, AB glue, etc., and some of these glues are quick-drying glue, leaving little time for subsequent alignment film, and some are glue with higher viscosity , cannot achieve large-area industrial atomization spraying, resulting in uneven coating thickness and low efficiency
[0009] Therefore, the PDMS membrane needs to be surface modified first, but the plasma and special surface modification process is more troublesome, and the parameter control requirements are strict, which is not suitable for industrialization.
Finally, the film sticking efficiency is low, the output is limited, and the quality is not easy to control

Method used

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  • Microfluidic chip and preparation process thereof
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  • Microfluidic chip and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The embodiment of the present invention provides a preparation process of a microfluidic chip, which includes the following steps:

[0048] Preparation steps of the adhesive:

[0049] According to parts by weight, the preparation step of the binder includes mixing the following raw materials: 80 parts of silicone (70131-67-8), 20 parts of calcium carbonate (471-34-1), 1.0 parts of catalyst (68611-44-9 ) and 1.0 part additive (N / A). After mixing, vacuum or centrifuge to remove air bubbles, mix with mixing equipment, and then package.

[0050] Processing steps of PDMS membrane:

[0051] Fix the knife mold on the punch table, and set the punching parameters according to the punching requirements:

[0052] For a PDMS film with a thickness of 0.2mm, the film thickness is 0.2mm plus the thickness of the protective layer is 0.1mm, a total of 0.3mm, and the impact force of the punch is set to 500 kg. Punch another 0.32mm, and discharge the punched waste through the chip rem...

Embodiment 2

[0060] The embodiment of the present invention provides a preparation process of a microfluidic chip, which is roughly the same as the preparation process provided in Example 1, the difference lies in the different parameters, and the difference is as follows:

[0061] The preparation steps of the adhesive are the same as above.

[0062] Processing steps of PDMS membrane:

[0063] Fix the knife mold on the punch table, and set the punching parameters according to the punching requirements:

[0064] For example, for a PDMS film with a thickness of 0.3 mm, the film thickness is 0.3 mm plus the thickness of the protective layer is 0.1 mm, a total of 0.4 mm, and the impact force of the punch is set to 500 kg. Punch another 0.42 mm, and discharge the punched waste through the chip discharge hole of the knife die, and then punch out micro-channels on the film.

[0065] Put the raw material PDMS film on the roller tensioning conveying device, and use the roller tensioning conveying...

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Abstract

The invention discloses a microfluidic chip and a preparation process thereof, and relates to the technical field of experimental appliances. Specifically, the preparation process uses a knife die toconduct punching cut processing on PDMS film into a microfluidic substrate with microchannels, especially for a microfluidic substrate with a large aspect ratio and a complex and dense microchannel structure, the punched and cut channels are more regular, the formability is high, the punched and cut substrate is regular and does not easily deform, and the preparation process has the advantages ofa high production efficiency, large output and a stable quality.

Description

technical field [0001] The invention relates to the technical field of experimental equipment, in particular to a microfluidic chip and a preparation process thereof. Background technique [0002] The microfluidic chip (miniature laboratory) is aimed at the traditional macroscopic laboratory. The traditional experiment is completed through the cooperation of some relatively large experimental equipment. The experiment occupies a relatively large space and consumes more reagents. It takes a long time, especially for some rare and precious reagents, and the cost of doing experiments with traditional experimental methods is very high. [0003] The role of the microfluidic chip is to miniaturize and integrate the traditional macroscopic experimental system, and use relevant knowledge of micro-electromechanical systems, fluid mechanics, chemistry, biology, etc., to integrate some traditional detections in a very small system. , to speed up the detection time, reduce the amount o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01L3/00
CPCB01L3/5027B01L3/502707B01L2300/12
Inventor 郑世阳黄蓓王磊周庭波吴志学
Owner 贵州中科金玖生物技术有限公司
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