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Non-taper laser machining method and machining device

A laser processing method and non-taper technology, which is applied to laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of large slit roughness, uncontrollable slit taper, and low quality. Easy-to-achieve, roughness-reducing effects

Active Publication Date: 2019-04-12
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of uncontrollable slit taper, large slit roughness and low quality in existing laser cutting methods, and provide a taper-free laser processing method and processing device, which can realize laser taper-free cutting , with the characteristics of high taper control precision and high efficiency

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  • Non-taper laser machining method and machining device
  • Non-taper laser machining method and machining device

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Embodiment Construction

[0028] The content of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] The invention provides a laser processing method. The long-focus deep rectangular flat-top light realized by the three-dimensional space compound shaping method is used for the first time to solve the laser thick plate cutting process. After a large number of process tests, the applicant conducted interactive tests and analysis on relevant parameters such as laser power, scanning speed, cutting path planning, focus position, focus spot size, and focus depth, and obtained the effect of laser focus depth on laser kerf taper, And the roughness has a very good improvement effect. The invention adopts a three-dimensional space compound shaping method to shape the laser beam into a rectangular flat-top light with a long focal depth for thick plate cutting, so as to realize high-quality laser cutting and manufacturing s...

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Abstract

The invention provides a non-taper laser machining method and machining device. According to the non-taper laser machining method and machining device, the problems of uncontrollable cutting slit taper, large slit roughness and low quality in an existing laser cutting mode, and laser non-taper cutting is realized. The non-taper laser machining method comprises the following steps that (1) two-dimensional shaping is carried out on a laser beam; a Gauss light spot of the laser beam is shaped into a rectangular uniform light spot of a two-dimensional plane; (2) three-dimensional shaping is carried out on the laser beam; the laser beam obtained in the step (1) is shaped into a long focal depth rectangular flat top laser beam; and (3) laser machining is carried out; the long focal depth rectangular flat top laser beam obtained in the step (2) is used for machining.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a taper-free laser processing method and a processing device, which can realize laser taper-free cutting. Background technique [0002] Laser cutting is widely used in fine cutting in various military and civilian fields such as aerospace, automobiles, medical equipment, instruments and meters. Laser cutting has become one of the mainstream processing methods due to its small heat-affected zone, no mechanical deformation, and no tool wear. However, the laser Gaussian beam has problems such as scattering angle and light blocking, which will cause the upper half of the slit surface to have a large slit width, neat and fine stripes, and small roughness. Problems such as flatness and large roughness. Therefore, it is urgent to develop a zero-taper, high-quality laser cutting method to meet the technical requirements of laser fine cutting. [0003] At present, the methods for laser ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/064B23K26/073
CPCB23K26/064B23K26/073B23K26/38
Inventor 王锋李珣李明
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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