Preparation process of PTFE ceramic composite high-frequency copper clad laminate

A technology of ceramic composite and preparation process, applied in electronic equipment, lamination, application, etc., can solve the problem of large dielectric loss of substrate, and achieve the effect of low dielectric loss, simple process and good reproducibility

Active Publication Date: 2019-04-19
JIAXING GLEAD ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent ZL201410796601.8 discloses that a high-frequency LTCC circuit module substrate is prepared by adding LTCC co-fired ceramic powder to PTFE powder. The substrate prepared by this method has a large dielectric loss

Method used

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  • Preparation process of PTFE ceramic composite high-frequency copper clad laminate
  • Preparation process of PTFE ceramic composite high-frequency copper clad laminate

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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0029] Such as figure 1 with figure 2 Shown, the material and process preparation of a kind of PTFE ceramic composite high-frequency copper-clad laminate proposed by the present invention can be realized by following steps:

[0030] 1. Bake titanium dioxide (TiO2), magnesium oxide (MgO), manganese dioxide (MnO2), zinc oxide (ZnO) and calcium oxide (CaO) at 130oC for 24 hours and then by weight (25-35% magnesium oxide , 45-55% titanium dioxide, 0-5% manganese dioxide, 0-5% zinc oxide, 0-5% calcium oxide) weighed; weighed powder...

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Abstract

The invention discloses a preparation process of a PTFE ceramic composite high-frequency copper clad laminate, comprising the following steps: composition of a ceramic filler: 25 to 35% of magnesium oxide, 45 to 55% of titanium dioxide, 0 to 5% of manganese dioxide, 0 to 5% of zinc oxide, and 0 to 5% of calcium oxide, etc.; and composition of slurry: 10 to 40% of a ceramic filler, 40 to 60% of a PTFE emulsion, 0.3 to 3% of a coupling agent, and 0 to 1% of an additive. According to the preparation process of the PTFE ceramic composite high-frequency copper clad laminate, the PTFE ceramic composite high-frequency copper clad laminate can be obtained through processes of pulping, glass cloth gluing, drying, slicing, dispensing, combined lamination, vacuum pressing, cutting and the like. The preparation method of the invention can help realize a high-precision dielectric constant, a low dielectric loss and a low water absorption rate of a dielectric constant 3 to 6 series of the PTFE ceramic composite high-frequency copper clad laminate.

Description

technical field [0001] The invention belongs to the field of high-frequency copper-clad laminates used in microwave circuits, and in particular relates to a preparation process of PTFE ceramic composite high-frequency copper-clad laminates. Background technique [0002] In recent years, with the rapid development of microelectronic information technology, electronic products are developing towards high frequency and high speed, especially the rapid development of 5G communication technology, which has brought great impact on traditional PCB copper clad laminates. Traditional FR-4 The PCB board will not be able to meet the requirements of 5G communication, the development of a low-cost, high-performance high-frequency board is particularly important. In recent years, scientific and technological workers have conducted extensive and in-depth research on the material selection of high-frequency and high-speed substrate materials and related microwave characteristics and physica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/02B32B15/20B32B15/18B32B7/08B32B33/00B32B38/16B32B37/06B32B37/10C08K3/24C08K3/22C08L27/18
CPCB32B5/02B32B7/08B32B15/18B32B15/20B32B33/00B32B37/06B32B37/1009B32B38/164B32B2260/021B32B2260/04B32B2260/046B32B2262/101B32B2307/204B32B2457/08C08K3/22C08K3/24C08K2003/2262C08K2003/2296C08L27/18
Inventor 易祖阳唐春宝许赛卿徐竞杰胡元云钮利耀
Owner JIAXING GLEAD ELECTRONICS CO LTD
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