Multi-row single-base-island lead wire framework with glue locking holes and SOT33-5L encapsulation element thereof

Abstract

The invention discloses a multi-row single-base-island lead wire framework with glue locking holes and an SOT33-5L encapsulation element thereof, and belongs to the technical field of electronic device manufacturing semiconductor encapsulation. The dimension of an arranged base island is matched with the dimension of a chip; the bonding distance of the chip and an inner lead pin is reduced; a relatively great current can be conducted; in addition, the heat generation quantity is small, so that the encapsulation requirement of chips which need relatively heavy current output can be met; meanwhile, the base island provided by the invention for carrying the chip is small; the structure is simple; the cost is low; in addition, the a wide lead pin and the base island are connected to form a heat conduction passage, so that the heat radiation of heat generation in the work process of the chip is better facilitated, so that the chip can work at a relatively low temperature. The single chip isbonded onto the base island of the lead wire framework; the glue locking holes are arranged in positions of two sides of the base islands and the connecting positions of the base islands and the inner lead pin; during the plastic encapsulation, the plastic encapsulation material penetrates through the glue locking holes, so that the firm combination of the plastic encapsulation material and the base island can be ensured; the stress can be released; the product reliability is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging for electronic device manufacturing, in particular to a lead frame with multiple rows of single-base islands with locking glue holes and its SOT33-5L package. Background technique [0002] Since the dawn of electronics manufacturing, the semiconductor industry has offered a wide variety of packages to enclose chips and provide electrical connections to semiconductor die. With the continuous development of emerging technologies such as mobile communication equipment and smart phones, semiconductor packaging is gradually tending to be high-density and miniaturized. [0003] In traditional packaging, DIP and SOP packaging are the basic packaging forms with a wide range of applications. With the development trend of integration and miniaturization in the semiconductor industry, the core component chips of semiconductors have also developed higher integration and smaller sizes. . Whil...

AI Technical Summary

Problems solved by technology

While the package shape remains unchanged, the bonding distance between the chip and the inner pins will increase, thereby increasing the internal resistance, inductance and parasitic capacitance of the IC device, reducing the performance of the high-frequency converter, and the greater the bonding distance The greater the impact, the smaller the current that can be carried, and the effect of heat conduction and signal output cannot be well realized, which greatly limits its application range

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