Lightweight high-strength electronic substrate glass and preparation method thereof

An electronic substrate, high-strength technology, applied in glass manufacturing equipment, glass molding, furnace types, etc., can solve problems such as large deflection, achieve good thermal expansion coefficient, reduce melting temperature, and wide molding temperature

Inactive Publication Date: 2019-05-03
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] For large and thin glass substrates, large deflection due to its own weight is a major problem in the manufacturing process

Method used

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  • Lightweight high-strength electronic substrate glass and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Step 1), according to the raw material mole percentage (mol%), accurately weigh 68.0% quartz sand, 8.8% boric anhydride, 11.40% alumina, 2.3% magnesium oxide, 8.79% calcium oxide, 0.55% oxide Strontium, 0.07% tin oxide;

[0032] Step 2), put the weighed raw materials into the mixer successively, and mix to form batching material after the uniformity is greater than 99%;

[0033] Step 3), add the batch material into the corundum crucible that has been heated to 1450°C; then, the temperature is raised to 1650°C for 15min, and after holding for 2h, the furnace temperature is cooled from 1650°C to 1420°C by 30min, and the glass is heated by a stirring paddle. The liquid was stirred for 5 minutes, and the temperature was kept at 1420 °C during the stirring process; then the temperature was raised to 1650 °C for 15 minutes, and the temperature was kept for 2 hours;

[0034] Step 4), the furnace temperature is cooled from 1650 ℃ to 1300 ℃ by 30min;

[0035] Step 5), pour the...

Embodiment 2

[0040] Step 1), according to the raw material mole percentage (mol%), accurately weigh 67.59% quartz sand, 9.84% boric anhydride, 11.06% alumina, 2.25% magnesium oxide, 8.65% calcium oxide, 0.54% oxide Strontium, 0.07% tin oxide;

[0041] Step 2), put the weighed raw materials into the mixer successively, and mix to form batching material after the uniformity is greater than 99%;

[0042] Step 3), add the batch material into the corundum crucible that has been heated to 1450°C; then, heat up to 1660°C for 20 minutes, and keep the temperature for 2 hours, cool down the furnace temperature from 1660°C to 1420°C over 30 minutes, and use a stirring paddle to cool the glass. The liquid was stirred for 5 minutes, and the temperature was kept at 1420 °C during the stirring process; then the temperature was raised to 1660 °C for 20 minutes, and the temperature was kept for 2 hours;

[0043] Step 4), the furnace temperature is cooled from 1660 ℃ to 1300 ℃ by 30min;

[0044] Step 5), ...

Embodiment 3

[0049] Step 1), according to the raw material mole percentage (mol%), accurately weigh 66.96% quartz sand, 10.67% boric anhydride, 10.96% alumina, 2.23% magnesium oxide, 8.57% calcium oxide, 0.54% oxide Strontium, 0.07% tin oxide;

[0050] Step 2), put the weighed raw materials into the mixer successively, and mix to form batching material after the uniformity is greater than 99%;

[0051] Step 3), adding the batch material into the corundum crucible that has been heated to 1450°C; then, the temperature is raised to 1670°C over 25 minutes, and after holding for 2 hours, the furnace temperature is lowered from 1670°C to 1410°C over 30 minutes, and the glass is heated by a stirring paddle. The liquid was stirred for 5 minutes, and the temperature was kept at 1410 °C during the stirring process; then the temperature was raised to 1670 °C for 25 minutes, and the temperature was kept for 2 hours;

[0052] Step 4), the furnace temperature is cooled from 1670 ℃ to 1300 ℃ by 30min; ...

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Abstract

The invention discloses a lightweight high-strength electronic substrate glass and a preparation method thereof. According to the preparation method provided by the invention, the electronic substrateglass prepared by the method has an extremely-small density, large hardness, a suitable thermal expansion coefficient and good dielectric properties; the preparation method reduces a melting temperature of the glass by increasing a boron oxide content and improves the melting efficiency; and the glass has low viscosity when molded, has a wide molding temperature, good molding performance, high production efficiency, energy saving and environmental protection, is suitable for low-cost mass production, and has high added value of products.

Description

technical field [0001] The invention belongs to the technical field of glass production, and relates to a light-weight and high-strength electronic substrate glass and a preparation method. Background technique [0002] With the development and popularization of liquid crystal display devices, more and more people use notebook computers, and the trend of large-scale TV sets also increases the weight of the entire liquid crystal display. Under the trend of large-size screen development, the substrate glass is also In order to reduce the weight of the entire display, it is necessary to reduce the density of the glass in addition to reducing the thickness of the glass substrate. At the same time, in the manufacturing process of the display, the process of splitting the mother glass into display substrates and the use environment of the display require the substrate glass to have very high strength. [0003] In addition, substrate glass is mainly used in mobile devices. The thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C6/04C03B19/02C03B5/06C03B25/00
Inventor 郭宏伟赵聪聪刘磊党梦阳王翠翠陈平谢驰刘帅
Owner SHAANXI UNIV OF SCI & TECH
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