Aluminum-silicon gradient material and selective laser melting forming method thereof

Abstract

The invention relates to a selective laser melting forming method of an aluminum-silicon gradient material. The selective laser melting forming method comprises the following steps of S1, designing the components and shape of the aluminum-silicon gradient material, and preparing raw materials with different silicon contents according to the weight percentage, wherein the raw materials comprise 22%-70% of silicon and the balance aluminum by weight; S2, smelting the raw materials to obtain aluminum-silicon alloy melts with different silicon contents; S3, preparing aluminum-silicon alloy powder with different silicon contents with the aluminum-silicon alloy melts obtained in the S2 through gas atomization separately; S4, preparing the aluminum-silicon gradient material in the design shape with the aluminum-silicon alloy powder with different silicon contents obtained in the S3 through a selective laser melting technology; and S5, performing heat treatment to the aluminum-silicon gradientmaterial obtained in the S4. The invention further relates to the aluminum-silicon gradient material prepared with the method. The method stated in the invention has the advantages of high designability, simplification of working procedures, high utilization rate of the material, high processing accuracy and the like; and the gradient material stated in the invention is high in designability, andapplicable for electronic packaging shells.

Description

technical field [0001] The invention relates to the technical field of gradient functional materials, in particular to an aluminum-silicon gradient material and a selective-area laser melting forming method thereof. Background technique [0002] Aluminum-silicon alloy has high thermal conductivity, controllable coefficient of thermal expansion, high specific strength, low density (<2.7g / cm 3 ), easy processing and plating, and good performance in machining, surface plating, laser welding, etc., it has broad application prospects in aviation, aerospace, electronics, communications and other fields, especially in high power density and high density requirements field. [0003] However, the existing homogeneous aluminum-silicon alloys are difficult to meet the requirements of thermal expansion matching, high thermal conductivity, machining, welding, etc., for example, low-silicon-content aluminum-silicon alloys have low mechanical properties, especially low elastic modulus ...

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Problems solved by technology

[0003] However, the existing homogeneous aluminum-silicon alloys are difficult to meet the requirements of thermal expansion matching, high thermal conductivity, machining, welding, etc., for example, low-silicon-content aluminum-silic...

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