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Segmented copolymer capable of spontaneously constructing specific nanostructure in epoxy resin and application of segmented copolymer to high performance modification of epoxy resin

A technology of block copolymer and epoxy resin, which is applied in the direction of epoxy resin glue, epoxy resin coating, adhesive type, etc., can solve the problem of high crosslinking density of cured products, insufficient toughness of EP cured products, and large internal stress And other issues

Active Publication Date: 2019-05-10
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cured product formed after EP curing has a high crosslinking density, a three-dimensional network structure in space, difficult sliding between molecular chains, and large internal stress, resulting in hard and brittle cured products, easy cracking, poor impact resistance and peeling resistance. It is difficult to meet the use requirements in the application, so that its application is limited to a certain extent. These shortcomings are caused by the insufficient toughness of EP cured products.

Method used

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  • Segmented copolymer capable of spontaneously constructing specific nanostructure in epoxy resin and application of segmented copolymer to high performance modification of epoxy resin
  • Segmented copolymer capable of spontaneously constructing specific nanostructure in epoxy resin and application of segmented copolymer to high performance modification of epoxy resin
  • Segmented copolymer capable of spontaneously constructing specific nanostructure in epoxy resin and application of segmented copolymer to high performance modification of epoxy resin

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Embodiment 1

[0038] Embodiment 1, preparation and performance detection of composite material of the present invention

[0039] One, the preparation of composite material of the present invention

[0040] 1 Experimental materials and reagents

[0041] BX-OH: polydimethylsiloxane, Japan Shin-Etsu Chemical Co., Ltd., product number X-22-107BX (R and R' in the structural formula are short hydrocarbon chain end units, for example: butyl (R-: CH 3 -CH 2 -CH 2 -CH 2 -), ethyl (-R'-: -CH 2 -CH 2 -), but the manufacturer did not give a specific structural formula). Caprolactone, polystyrene, dibromoisobutyryl bromide, and stannous octoate were all chemically pure and were purchased from Shanghai Aladdin Biochemical Technology Co., Ltd. EP: bisphenol A epoxy resin (E51), Phoenix brand epoxy resin, model WSR618 (E51), Nantong Xingcheng Material Co., Ltd. Chromaticity: ≤40Pt-Co, epoxy equivalent: 184~195g / mol, hydrolyzed chlorine: ≤0.2%, 50mg / kg, volatile matter: 0.5%, viscosity (25°C): 10000...

Embodiment 2

[0084]The BXLS / EP composite material prepared in Example 1 is used as the matrix resin, and the commonly used modifiers in the fields of coatings, electrical materials, casting packaging materials, adhesives, sealants, etc. are prepared to prepare coatings, electrical materials, casting packaging materials, etc. Materials, adhesives, sealants.

[0085] In summary, the BXLS block copolymer forms a novel nanostructure of the "paramecium" shape in the epoxy resin, which makes the BXLS / epoxy resin composite material prepared by the present invention have an extremely low addition amount of the BXLS block copolymer. Under the circumstances, the toughness of the material is significantly increased and it also has more excellent mechanical properties, which greatly broadens the application field of epoxy resin.

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Abstract

The invention provides a segmented copolymer capable of spontaneously constructing a specific nanostructure in epoxy resin and application of the segmented copolymer to high performance modification of epoxy resin. According to experimental results, a quasi paramecium shaped novel nanostructure is formed in epoxy resin by the BXLS segmented copolymer, toughness of a BXLS / epoxy resin composite material is remarkably improved under the condition of extremely low adding quantity of the BXLS segmented copolymer while excellent mechanical properties are achieved, and an epoxy resin application field is greatly expanded.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and in particular relates to a block copolymer capable of spontaneously constructing a specific nanostructure in epoxy resin and its application in high-performance epoxy resin. Background technique [0002] Epoxy resin (EP) is an excellent high-strength thermosetting resin and is a widely used matrix material. EP molecules have two or more epoxy groups, which can be cross-linked and cured with amines, acid anhydrides, and polyamides to form a highly cross-linked three-dimensional network structure, and the cured product has wear resistance Good, excellent heat resistance, good chemical stability, excellent electrical insulation, high strength, low shrinkage, easy processing and molding, chemical resistance, good adhesion to substrates and low price, etc., as an electronic coating , coatings, electrical materials, casting packaging materials, adhesives, and sealant matrix resins are wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F293/00C08L63/00C08L53/00C09D163/00C09D153/00C09J163/00C09J153/00
Inventor 邹华维陈洋衡正光张浩若李霂萱梁梅
Owner SICHUAN UNIV
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