Texturing process combining laser with acid solution for silicon wafer

Abstract

The present invention provides a texturing process combining laser with an acid solution for a silicon wafer. The process comprises that a silicon wafer is textured with an acid solution after laser texturing. The beneficial effects of the invention are that the diffused silicon wafer is textured with laser; uneven molten polycrystalline silicon is formed on the smooth surface of the silicon waferand the roughness of the silicon wafer surface is increased; the texturing steps are simple and the equipment investment cost is low by using laser texturing; the laser-textured silicon wafer is wet-etched by the acid solution so that the surface roughness of the silicon wafer is further increased; the protective adhesive is not easy to fall off and has a large adhesion.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer production, and in particular relates to a silicon wafer laser and acid solution combined texturing process. Background technique [0002] With the development of semiconductor technology, the requirements for passivation of semiconductor surfaces are getting higher and higher. As a passivation material, it should have good electrical properties, reliability, good chemical stability, operability and economy. According to the above requirements, special glass for semiconductor passivation has been applied in the semiconductor industry as an ideal semiconductor passivation material. Chips made of special glass for semiconductor passivation are called glass passivation process chips (GPP chips). [0003] At present, after the silicon wafers used in GPP chips in the industry are diffused, phosphosilicate glass and borosilicate glass are formed on the surface of the silicon wafers. After the dif...

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Problems solved by technology

[0003] At present, after the silicon wafers used in GPP chips in the industry are diffused, phosphosilicate glass and borosilicate glass are formed on the surface of the silicon wafers. After the diffusion, the next process is to apply protective glue to prepare for the subsequent glass passivation process. Before coating the protective glue, it is necessary to carry out the texturing process, which increases the surface roughness of the diffused silicon wafer, which is beneficial to the coating of the protective glue. The current method of texturing is dry sanding, using quartz sand after high-speed spraying. out, the surface of the silicon wafer is polished to increase the surface roughness of the silicon wafer

However, the obvious disadvantages of using the dry sanding process to make texturing are that the silicon wafers produced by dry sanding are subjected to a large force, which makes the silicon wafers easy to break, and the texturing effect is not obvious, and the roughness is relatively high. Small, complex process, high input cost

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