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Printed circuit board and manufacturing method thereof

A technology of printed circuit boards and manufacturing methods, which is applied to printed circuit components and other directions, can solve problems such as inlaid instability, unsatisfactory heat dissipation, and short circuits, and achieve the effects of ensuring electrical performance, avoiding contact, and avoiding short circuits

Active Publication Date: 2020-10-16
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation effects of the above methods are not ideal, and the method (2) also has the defect that the mosaic is not stable, and it is easy to cause a short circuit.

Method used

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  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] This embodiment is a method for making a printed circuit board, the printed circuit board is a thick copper PCB, and its structure is as follows: figure 1 As shown, it includes the third core board 103, the third bonding sheet 203, the first core board 101, the first bonding sheet 201, the second core board A102a, the second bonding sheet A 202a, the second core Plate B 102b.

[0031] The steps of the preparation method are as follows, and the process flow chart is shown in figure 2 :

[0032] (1) Obtain the first core board 101, the surface of the first core board 101 includes a heat dissipation area; the first core board 101 is etched to form an inner layer pattern according to a conventional method;

[0033] (2) Print heat-dissipating ink (Peters HSP ink PP2740) on the heat-dissipating area to form a heat-dissipating ink layer 301 with a thickness of 150 μm;

[0034] (3) Attach the copper particles 302 (thickness: 6oz) on the heat-dissipating ink layer 301 with a...

Embodiment 2

[0039] This embodiment is a manufacturing method of a printed circuit board, the structure and manufacturing method of this printed wiring board are similar to embodiment 1, the difference is that:

[0040] In step (3), the curing process condition is thermal curing, the curing temperature is 120° C., and the curing time is 150 min.

Embodiment 3

[0042] This embodiment is a manufacturing method of a printed circuit board, the structure and manufacturing method of this printed wiring board are similar to embodiment 1, the difference is that:

[0043] In step (5), the process condition of pressing is hot pressing, and the pressing temperature is gradually increased to 250° C., and the pressure is gradually increased to 400 Psi.

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Abstract

The invention relates to a printed circuit board (PCB) and a manufacturing method thereof. The manufacturing method comprises the following steps: obtaining a first core board, wherein the surface ofthe first core board includes a heat dissipation area; printing heat dissipation ink in the heat dissipation area to form a heat dissipation ink layer; arranging copper particles on the heat dissipation ink layer and curing; obtaining a sub-board; obtaining a bonding sheet, wherein a region corresponding to the copper particles on the bonding sheet is window-opened; obtaining a second core board,wherein a region corresponding to the copper particles on the second core board is window-opened; and stacking the sub-board, the bonding sheet and the second core board, and laminating in sequence. The method can greatly increase the heat dissipation efficiency of the PCB, especially a thick copper PCB without causing short circuit of a circuit, so that the circuit board has stable electrical performance.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] With the increasing popularity of electric vehicles, thick copper printed circuit boards (thick copper PCBs, usually referring to PCBs with a copper thickness of not less than 18 μm on a rigid core board and a copper thickness of not less than 0.009 mm on a flexible core board) are used as The demand for electronic components of automobiles is also increasing. [0003] As an automotive electronic component, thick copper PCB will generate high heat, especially when it is used in high-power voltage parts such as engine power supply part and automobile central electrical power supply part. Therefore, the effective heat dissipation of thick copper PCB has always been a research hotspot. [0004] At present, the newer method of strengthening the heat dissipation of thick copper PCB is: (1) by opening h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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