Process for vacuum electroplating NI on hard disk to enhance surface roughness
A surface roughness and vacuum electroplating technology, which is applied in vacuum evaporation plating, metal material coating process, sputtering plating, etc., can solve the problems of poor sputtering effect, save cost, facilitate operation, and enhance surface roughness degree of effect
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Embodiment 1
[0015] Install the hard disk product on the evaporation coating equipment, put in the evaporation material, and vacuum to 6×10 -3 Pa, ventilation with Ar to 1×10 -1 Pa, 1200W radio frequency discharge for 5 minutes, the Ar gas is fully ionized into an ion state, and the material is energized to evaporate. At the same time, the Ar gas is continuously introduced, and the radio frequency discharge is continued to maintain the vacuum degree at 4×10 -2 Pa, evaporate the Cu material, at an interval of 12 minutes, evaporate the NI material, and open the atmosphere to complete the entire vaporization process.
Embodiment 2
[0017] Install the hard disk product on the evaporation coating equipment, put in the evaporation material, and vacuum to 6×10 -3 Pa, ventilation with Ar to 1×10 -1 Pa, 1200W radio frequency discharge for 5 minutes, the Ar gas is fully ionized into an ion state, and the material is energized to evaporate. At the same time, the Ar gas is continuously introduced, and the radio frequency discharge is continued to maintain the vacuum degree at 4×10 -2 Pa, apply a voltage of 160V, evaporate the Cu material for 140s, at an interval of 12 minutes, evaporate the NI material, and open the atmosphere to complete the entire vaporization process.
Embodiment 3
[0019] Install the hard disk product on the evaporation coating equipment, put in the evaporation material, and vacuum to 6×10 -3 Pa, ventilation with Ar to 1×10 -1 Pa, 1200W radio frequency discharge for 5 minutes, the Ar gas is fully ionized into an ion state, and the material is energized to evaporate. At the same time, the Ar gas is continuously introduced, and the radio frequency discharge is continued to maintain the vacuum degree at 4×10 -2 Pa, add 160V voltage, evaporate the Cu material for 140s, at an interval of 12 minutes, add 85V voltage, evaporate the NI material for 120s, open the atmosphere, and complete the entire steaming process.
[0020] The Ar gas is ionized to clean the surface of the product; the surface of the special hard disk to be processed can be further roughened, which is conducive to the adhesion of the metal. The test result of the 100 grid tape after steaming is 5B.
[0021] Since the RF discharge continues until the material is evaporated, during the ...
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