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A kind of activation solution and its regeneration method for electroless plating on the surface of non-conductive substrate

A technology of substrate surface and activation solution, applied in liquid chemical plating, metal material coating process, coating, etc. There are many problems such as by-products, so as to achieve good electrical interconnection performance, reduce the possibility of sediment, and achieve the effect of good bonding force.

Active Publication Date: 2021-03-23
深圳市天熙科技开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the rapid aging of the traditional colloidal palladium system activation solution, there are many by-products of tetravalent tin, which leads to the problem of insufficient bonding between the chemical plating layer and the substrate, and it is difficult to meet the needs of high-performance circuit board manufacturing.

Method used

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  • A kind of activation solution and its regeneration method for electroless plating on the surface of non-conductive substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Prepare the activation solution according to the method of aforementioned (1), the specific proportion is as follows:

[0064] Palladium chloride 0.1g / L

[0065] Tin protochloride 12.0g / L

[0066] Glycolic acid 25.0g / L

[0067] Hydrochloric acid 2.5mol / L

[0068] Sodium chloride 160g / L

[0069] Heat the prepared activation solution to 46°C for later use. The through-hole copper clad laminate with a thickness of 2.0mm to be tested is processed according to the hole metallization process of a~i mentioned above. After the copper plating is completed, the sample is dried for test evaluation, and the obtained result is recorded as 1-1;

[0070] Keep the activation solution at 46°C, and continue to pass the activation solution into the air for 2 hours. When the color of the solution turns colorless to light yellow, stop the introduction of air, add tin nuggets according to the amount of metal tin added at 10g / L, and stir until the tin nuggets Dissolved, the color of the ...

Embodiment 2

[0072] Prepare the activation solution according to the method of aforementioned (1), the specific proportion is as follows:

[0073] Palladium chloride 0.065g / L;

[0074] Tin protochloride 18.0g / L;

[0075] Glycolic acid 5.0g / L;

[0076] Tartaric acid 30g / L;

[0077] Sulfuric acid 1.5mol / L;

[0078] Sodium chloride 200g / L;

[0079] Urea 10g / L.

[0080] Heat the prepared activation solution to 50°C for later use. The through-hole copper-clad laminate with a thickness of 2.0mm to be tested is processed according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, the sample is dried for test evaluation, and the obtained results are recorded as 2-1.

[0081] Keep the activation solution at 50°C, and continue to pass the activation solution into the air for 4 hours. When the color of the solution becomes colorless to light yellow, stop the introduction of air, add tin nuggets according to the amount of metal tin added at...

Embodiment 3

[0083] Prepare the activation solution according to the method of aforementioned (1), the specific proportion is as follows:

[0084] Palladium chloride 0.25g / L;

[0085] Tin protochloride 25.0g / L;

[0086] Lactic acid 15.0g / L;

[0087] Tartaric acid 30.0g / L;

[0088] Hydrochloric acid 1.0mol / L;

[0089] Sodium chloride 230g / L;

[0090] Urea 15.0g / L.

[0091] Heat the prepared activation solution to 48°C for later use. The through-hole copper-clad laminate with a thickness of 2.0 mm to be tested is processed according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, the sample is dried for test evaluation, and the obtained results are recorded as 3-1.

[0092] Keep the activation solution at 48°C, and continue to pass the activation solution into the air for 3 hours. When the color of the solution becomes colorless to light yellow, stop the introduction of air, add tin nuggets according to the amount of metal tin a...

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Abstract

The invention relates to an activation solution used for non-conductive base material surface chemical plating and a regeneration method of the activation solution. The disclosed activation solution comprises the constituents of palladium chloride, stannous chloride, organic carboxylic acid containing hydroxide radicals, an acidity regulator, a stabilizer and deionized water, wherein the organic carboxylic acid containing the hydroxide radicals can be selected from one or multiple of glycolic acid, lactic acid, malic acid and tartaric acid. The activation solution with the above constituents has a regeneration characteristic, the activation solution losing catalytic activity can be regenerated through the method that pure tin is dissolved in the activation solution, the service life of theactivation solution can be prolonged, and the stability of the activation solution can be improved; and the above activation solution is used for treating a non-conductive base material, the advantages that catalytic chemical plating inducing time and complete plating time are short, plating of the surface of the material is not skipped, the palladium content in the activation solution is low, and cost is low are achieved, and the activation solution is suitable for application of surface chemical plating of non-conductive base materials such as a circuit board and plastic.

Description

technical field [0001] The invention relates to the field of PCB circuit board manufacturing, in particular to an activation solution and a reproducible method for performing a hole metallization electroless plating process in a PCB manufacturing process, and a method for preparing a circuit board. At the same time, the present invention can also be applied to the process flow of metallization (such as metallization treatment of plastic electroplating) for other non-metallic materials. Background technique [0002] In the preparation process of PCB board, based on the electroless copper plating using palladium catalyst as the catalyst, the hole metallization process is the electroless copper plating with palladium particles as the catalyst. The specific principle and application are in US patents US3,011,920 and US3, 532,518 and US3,095,309 have been described in detail. [0003] With the development of electronic assembly technology in the field of modern electronics indus...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/30C23C18/18
Inventor 张磊李晓彬郑雪明
Owner 深圳市天熙科技开发有限公司
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