Circuit board material
A technology for circuit boards and raw materials, applied in the field of circuit boards, can solve the problems of high junction temperature of LED, obstruction of heat dissipation, light decay, etc., and achieve the effects of excellent mechanical properties, good heat dissipation effect, and strong oxidation resistance.
Inactive Publication Date: 2019-06-11
刘向东
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Problems solved by technology
However, due to the problem of LED heat dissipation, a potential technical problem "serious light failure of LED street lamps" has seriously restricted the development of the LED industry. Product production cycle, luminous efficiency, stability
The problem of LED street light decay is affected by temperature. The design of heat dissipation substrate fins and heat dissipation modules has been painstakingly designed to obtain a good heat dissipation effect. However, since LED street lights are often used in outdoor occasions, they need to be protected by baking paint to prevent weather erosion. The hindrance of the heat dissipation link still causes poor temperature and heat dissipation, resulting in the problem of light decay
The light attenuation problem of LED street lamps has caused many LED street lamps installed less than one year to fail to pass the certification and acceptance of the user unit
Method used
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[0010] The following will be further described in conjunction with specific embodiments, but the following specific embodiments should not be construed as limiting the subject invention. Various modifications and variations that can be obviously made by those skilled in the art on the basis of the present invention should all fall within the scope of the present invention.
[0011] A circuit board material, the raw materials of which include the following components by weight: 50 parts of decabromodiphenyl acid, 3 parts of magnesium hydroxide, 5 parts of antimony trioxide, 1 part of unsaturated resin flame retardant, 0.1 parts of nano-zinc oxide 3 parts of polyamide flame retardant, 15 parts of carpet backing flame retardant, 1 part of EPDM rubber, 0.1 part of styrene-butadiene rubber, 0.2 part of barium tetratitanate, 3 parts of glass fiber, and 2 parts of limestone. In this embodiment, the average particle diameter of the antimony trioxide is 15-40 nm, and the average partic...
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Abstract
The invention discloses a circuit board material. Raw materials of the circuit board material comprise the following components of, in parts by weight, 50-80 parts of decabromobiphenyl acid, 3-15 parts of magnesium hydroxide, 5-15 parts of antimonous oxide, 1-5 parts of unsaturated resin flame retardant, 3-15 parts of polyamide flame retardant, 15-20 parts of carpet backing adhesive flame retardant, 1-2.5 parts of ethylene propylene diene monomer, 0.1-0.5 part of butadiene styrene rubber, 0.2-1.5 parts of barium tetratitanate, 3-10 parts of glass fibers and 2-15 parts of limestone. In the circuit board material, the decabromobiphenyl acid is used as a main material in cooperation with the added materials of the magnesium hydroxide, the antimonous oxide and the like, by controlling contentsof the raw materials, performance of the materials has a synergistic effect in promotion, the obtained ceramic material has a good heat dissipating effect, and is high in oxidation resistance, and the mechanical performance is excellent.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board material. . Background technique [0002] With the rising awareness of global environmental protection, energy saving and power saving has become an inevitable trend. The LED industry is one of the industries with the best development potential and attracting attention this year. LED products are energy-saving, power-saving, high-efficiency, fast response time, It has the advantages of long life cycle, environmental protection and mercury-free. However, due to the problem of LED heat dissipation, a potential technical problem "serious light failure of LED street lamps" has seriously restricted the development of the LED industry. Product production cycle, luminous efficiency, stability. The problem of LED street light decay is affected by temperature. The design of heat dissipation substrate fins and heat dissipation modules has been painstakingly design...
Claims
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IPC IPC(8): C08L23/16C08L9/06C08K13/04C08K7/14C08K3/22C08K3/26C08K5/095
Inventor 刘向东
Owner 刘向东