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High-thermal-conductivity composite thermal interface material with two-phase bicontinuous through structure

A thermal interface material and high thermal conductivity technology, applied in the field of thermal conductive materials, can solve problems such as limiting the application of liquid metal thermal interface materials, circuit pollution of electronic components, material migration, etc., achieving significant thermal conductivity advantages, solving spillage, and improving thermal conductivity. Effect

Inactive Publication Date: 2019-06-18
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high fluidity of liquid metal also brings about the problem of material migration, which is easy to cause circuit pollution and even short circuit of electronic components, which limits the application of liquid metal as a thermal interface material.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0010] The composite thermal interface material provided in this embodiment is composed of copper foam and gallium indium alloy. The porosity of copper foam is 98%, and the pore size is 0.25 mm. The composition of gallium indium alloy is 75Ga25In, and its melting point is about 16°C. Heat the gallium-indium alloy to 30°C and keep it warm for standby; then put the foamed copper in the vacuum forming mold, close the mold, heat the mold to 30°C, keep it warm for standby; then close the feed valve of the mold, open the vacuum valve, and put the mold Vacuumize to make the pressure in the cavity lower than 10Pa; then close the vacuum valve and open the feed valve, so that liquid metal enters the mold cavity through the feed valve to fill the pores of foamed copper; then cool the mold to 6°C, open the mold, and get Composite thermal interface materials.

example 2

[0012] The composite thermal interface material provided in this embodiment is composed of foamed copper and gallium tin alloy. The porosity of copper foam is 95%, and the pore size is 0.25mm. The composition of gallium-tin alloy is 92Ga8Sn, and its melting point is about 20°C. Heat the gallium-indium alloy to 30°C and keep it warm for standby; then put the foamed copper in the vacuum forming mold, close the mold, heat the mold to 30°C, keep it warm for standby; then close the feed valve of the mold, open the vacuum valve, and put the mold Vacuumize to make the pressure in the cavity lower than 10Pa; then close the vacuum valve and open the feed valve, so that the liquid metal enters the mold cavity through the feed valve to fill the pores of foamed copper; then cool the mold to 10°C, open the mold, and get Composite thermal interface materials.

example 3

[0014] The composite thermal interface material provided in this embodiment is composed of copper foam and indium-bismuth-tin alloy. The porosity of copper foam is 95%, and the pore size is 0.25 mm. Indium bismuth tin alloy composition 53.2In19.6Bi27.2Sn, melting point is about 43 ℃. Heat the indium-bismuth-tin alloy to 55°C and keep it warm for standby; then place the copper foam in a vacuum forming mold, close the mold, heat the mold to 55°C, keep it warm for standby; then close the feed valve of the mold, open the vacuum valve, and put Vacuumize the mold to make the pressure in the cavity lower than 10Pa; then close the vacuum valve and open the feed valve, so that liquid metal enters the mold cavity through the feed valve to fill the pores of foamed copper; then cool the mold to 30°C, open the mold, A composite thermal interface material is obtained.

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Abstract

The invention provides a high-thermal-conductivity composite thermal interface material composed of foam metal and low-melting-point alloy. Holes of the foam metal are filled with the low-melting-point alloy to form a two-phase continuous through heat conduction network structure. At the working temperature, the low-melting-point alloy exists in a liquid form, and the gaps of the heat transfer interface can be filled with the liquid metal to reduce the interface thermal resistance. The foam metal can provide rich heat conduction paths and prevent the liquid metal from overflowing. The composite thermal interface material has a bicontinuous structure, the heat conductivity coefficient is high, preparation is simple, use is convenient, and pollution or equipment short-circuit faults caused by liquid metal overflow can be avoided.

Description

technical field [0001] The invention relates to the field of thermally conductive materials, in particular to a high thermally conductive composite thermal interface material composed of foam metal and low melting point alloy. Background technique [0002] The thermal conductivity of thermal interface materials is directly related to the performance, lifetime and reliability of various devices such as LEDs, aerospace systems, microelectronics and photovoltaics. Usually the interface between the heat generating element and the heat dissipating element is uneven, there are gaps, and the air in the gap is a heat transfer medium with a relatively poor thermal conductivity (the thermal conductivity of air is 0.026W / (m·K)), which will hinder The path of heat conduction increases thermal resistance. In order to ensure the normal operation of heat-generating components, it is necessary to add a material that can transfer heat quickly and efficiently—thermal interface material (TIM)...

Claims

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Application Information

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IPC IPC(8): B22D18/06B22D23/04F28F21/08
Inventor 朱海涛朱晴冯晴晴张灿英吴大雄
Owner QINGDAO UNIV OF SCI & TECH
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