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Tin-nickel solder IMC layer metallographic corrosive agent and metallographic structure display method thereof

A technology of metallographic structure display and metallographic corrosion, which is applied in the field of metallographic structure observation and test of tin-nickel solder IMC layer, can solve the problems of IMC morphology and thickness misjudgment, IMC metallographic microstructure interface blurring, etc.

Inactive Publication Date: 2019-06-21
CHIPMOS TECHSHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the industry observes the morphology and thickness of IMC by preparing microsections, but the metallographic microstructure interface of IMC obtained by this method is blurred, see figure 1 , easily lead to misjudgment of IMC morphology and thickness

Method used

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  • Tin-nickel solder IMC layer metallographic corrosive agent and metallographic structure display method thereof
  • Tin-nickel solder IMC layer metallographic corrosive agent and metallographic structure display method thereof
  • Tin-nickel solder IMC layer metallographic corrosive agent and metallographic structure display method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The tin-nickel solder alloy metallographic etchant in this implementation case is prepared from hydrochloric acid with a mass percentage of 36% and ethanol with a mass percentage of 95.5% according to a volume ratio of 1:9.

[0044] Mechanically grind and polish the solder alloy sample first, soak the mechanically polished solder alloy sample in the metallographic etchant for 50 seconds, rinse it with running water for 8 seconds, and then bake it in an oven at 50°C for 5 minutes to obtain The corroded solder alloy sample was finally observed with a high-magnification optical microscope and a scanning electron microscope. The obtained images are as follows: image 3 shown.

Embodiment 2

[0046] The tin-nickel solder alloy metallographic etchant in this implementation case is prepared from hydrochloric acid with a mass percentage of 36.7% and ethanol with a mass percentage of 96% according to a volume ratio of 1:9.

[0047] Mechanically grind and polish the solder alloy sample first, soak the mechanically polished solder alloy sample in the metallographic etchant for 45s, wash it with running water for 5s, and then bake it in an oven at 50°C for 3min to obtain The corroded solder alloy sample was finally observed with a high-magnification optical microscope and a scanning electron microscope. The obtained images are as follows: Figure 4 shown.

Embodiment 3

[0049] The tin-nickel solder alloy metallographic etchant in this implementation case is prepared from 38% by mass hydrochloric acid and 97.5% by mass ethanol according to the volume ratio of 1:9.

[0050] Mechanically grind and polish the solder alloy sample first, soak the mechanically polished solder alloy sample in the metallographic etchant for 60s, rinse with running water for 10s, and then bake in an oven at 50°C for 4min to obtain The corroded solder alloy sample was finally observed with a high-magnification optical microscope and a scanning electron microscope. The obtained images are as follows: Figure 5 shown.

[0051] Through the above examples, it is not difficult to find that because hydrochloric acid is a strong acid and ethanol has reducing properties, it can better infiltrate the surface of the sample, and the microetching effect is more ideal. Using the technical solution can greatly improve the corrosion efficiency of the IMC layer and the display effect ...

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Abstract

The embodiment of the invention discloses a tin-nickel solder IMC (Intermetallic compound) layer metallographic corrosive agent and a metallographic structure display method thereof. The metallographic corrosive agent is prepared by 36-38% of hydrochloric acid and more than 95% of ethyl alcohol in mass percent according to a volume ratio of 1:9. The metallographic structure display method comprises the following steps of: performing mechanical grinding of a test sample; performing mechanical polishing of the grinded test sample; employing the metallographic corrosive agent to perform metallographic corrosion of the polished test sample; washing the test sample after metallographic corrosion; drying the cleaned test sample; and employing a micro device to display an IMC metallographic microscopic structure interface of the dried test sample and clearly display the morphology of the tin-nickel solder IMC layer.

Description

technical field [0001] The invention relates to a metallographic etchant for a tin-nickel solder IMC layer and a metallographic structure display method, and belongs to the technical field of metallographic structure observation and testing of the tin-nickel solder IMC layer. Background technique [0002] The internal structure of metal materials is directly and closely related to material properties such as hardness, strength, and ductility. Metallographic observation is the most direct and effective method for studying the internal structure of metal materials. Metallography refers to the chemical composition of metals or alloys and the physical and chemical states inside the metals or alloys of various components. The metallographic microstructure observation method can be used to observe the boundaries and thicknesses of different metal or alloy layers. [0003] To observe the metallographic microstructure of the IMC (Intermetallic compound, interfacial alloy co-compoun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/84G01N1/28G01N1/32G01N1/34
Inventor 郑明辉张健健郭玲杨思
Owner CHIPMOS TECHSHANGHAI
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