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High barrier and high thermal conductivity packaging structure for flexible oled display and preparation method thereof

A packaging structure and display technology, which is applied in semiconductor/solid-state device manufacturing, identification devices, semiconductor devices, etc., can solve the problems of poor heat dissipation performance, achieve excellent barrier performance, facilitate heat dissipation, and improve the effect of heat conduction rate

Active Publication Date: 2021-08-06
JIANGSU SIDIKE NEW MATERIALS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the existing OLED device packaging structure only unilaterally improves the barrier performance of water and oxygen, thereby making the heat dissipation performance poor, thereby providing a high barrier and high thermal conductivity packaging structure and the package Preparation method of the structure

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  • High barrier and high thermal conductivity packaging structure for flexible oled display and preparation method thereof

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Experimental program
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Embodiment 1

[0040] This embodiment provides a flexible OLED display with high barrier and high thermal conductivity packaging structure, such as figure 1 As shown, it consists of an inorganic passivation layer 1 and a composite buffer layer 2. In order to improve the water and oxygen barrier performance of OLED devices and improve the flatness of the film-forming substrate, it is necessary to alternately stack at least two inorganic passivation layers 1 and at least one composite buffer layer 2, and the ratio of the number of inorganic passivation layers 1 to The composite buffer layer 2 has one more layer, so that the outermost layer of the packaging structure is the inorganic passivation layer 1 . Wherein, the number of layers of the inorganic passivation layer 1 is 5 layers, and the number of layers of the composite buffer layer 2 is 4 layers.

[0041] The luminous efficiency of OLED devices cannot reach 100% during operation, and a large part of the electrical energy is converted int...

Embodiment 2

[0050] This embodiment provides a method for preparing the packaging structure as in Embodiment 1, including:

[0051] (1) Preparation of the first inorganic passivation layer

[0052] Specifically, a flexible substrate containing an OLED display layer is provided, and the first inorganic passivation layer is formed on the flexible substrate and the OLED display layer by chemical vapor deposition, and the film-forming temperature of the first inorganic passivation film layer is 115°C. The thickness of the film is 1 μm, which protects various functional materials of the OLED display layer.

[0053] (2) Preparation of the first composite buffer layer

[0054] Specifically, the graphene oxide fiber, the first organic material, the second organic material and the solvent dimethyl sulfoxide are mixed according to the mass ratio of 1:0.3:60:350 and then spin-coated on the first layer of inorganic material in step (1). On the passivation layer, bake at 140° C. for 20 minutes to for...

Embodiment 3

[0063] The present invention provides a high-barrier and high-thermal-conduction packaging structure for flexible OLED displays. Unlike Embodiment 1, the number of layers of the composite buffer layer 2 can also be set to 1 layer, 2 layers, or 3 layers. Correspondingly, the inorganic passivation layer The number of layers of 1 is set to 2 layers, 3 layers, or 4 layers, as long as the number of layers of the inorganic passivation layer 1 is one more than the number of layers of the composite buffer layer 2 so that the outermost layer of the packaging structure is the inorganic passivation layer 1 That's it.

[0064] As a further modification of an alternative embodiment, the thickness of the composite buffer layer 2 can be set to 4 μm, 5 μm, 7 μm, or 8 μm, and the thickness of each composite buffer layer 2 can be the same or different;

[0065] The thickness of the inorganic passivation layer 1 can also be set to 0.5 μm, 0.65 μm, 0.95 μm, etc., and the thickness of each inorgan...

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Abstract

The invention belongs to the field of display technology, and in particular relates to a high barrier and high thermal conductivity packaging structure for flexible OLED display and a preparation method thereof. The packaging structure provided by the present invention includes alternately stacked inorganic passivation layers and composite buffer layers. The composite buffer layer includes a thermally conductive mesh layer and an organic layer embedded in the thermally conductive mesh layer. The thermally conductive mesh layer is exposed on the surface of the organic layer and is in contact with the organic layer. Inorganic passivation layer bonding. In the packaging structure of this structure, each layer is alternately stacked, which has excellent barrier performance to water and oxygen; the thermal conductive mesh layer improves the heat conduction rate of the packaging structure, which is beneficial to the heat dissipation of the OLED device, avoiding the accelerated deterioration of the OLED device material, and prolonging the OLED device. service life. The preparation method provided by the present invention prepares composite buffer layers of different layers at different temperatures, and the thickness of the composite buffer layer is greater than the thickness of the inorganic passivation layer, which not only protects various functional materials of the OLED display layer, but also improves the performance of the inorganic passivation layer. of compactness.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a high barrier and high thermal conductivity packaging structure for flexible OLED display and a preparation method thereof. Background technique [0002] Organic Light-Emitting Diode (OLED) is an active light-emitting device, which has the advantages of high contrast, wide viewing angle, low power consumption, thin size, etc., and is expected to become the mainstream flat panel display technology of the next generation. The most attractive thing about organic light-emitting diodes is that they can be flexible. Specifically, organic light-emitting diodes are fabricated on flexible polymer substrates, such as polyethylene (PE), polypropylene (PP), polystyrene (PS), and polystyrene (PS). Ethersulfone (PES), polyethylene naphthalate (PEN), polyimide (PI), etc., to realize that OLED devices can be bent and rolled into arbitrary shapes. [0003] However, OLED devices are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56G09F9/30H01L27/32
Inventor 金闯张庆杰
Owner JIANGSU SIDIKE NEW MATERIALS SCI & TECH CO LTD