Normal-temperature curing conductive adhesive and preparation method thereof

A room temperature curing, conductive adhesive technology, used in the field of conductive adhesives, can solve the problems of long curing time at room temperature, corrosion of the bonded substrate, low bonding strength, etc., achieving short curing time at room temperature, fast drying speed, volume The effect of low resistivity

Inactive Publication Date: 2019-06-25
北京氦舶科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silicone system, although the room temperature curing type has a longer pot life, but the curing reaction has by-products such as ethanol and acetone, which easily cause corrosion of the bonded substrate
Silicone system, the adhesive film formed after curing is relatively soft, and there are technica

Method used

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  • Normal-temperature curing conductive adhesive and preparation method thereof
  • Normal-temperature curing conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] A normal temperature curing conductive adhesive is prepared by the following method:

[0062] (1) At 25°C, 10 parts of thermoplastic alcohol-soluble acrylic resin B725 with a viscosity of 3000 cps and 30 parts of absolute ethanol were added to the reactor and stirred and mixed for 5 hours;

[0063] (2) At 25°C, mix 1 part of alcohol ether solvent dispersant LD-1211, water-oil general-purpose polyether modified polysiloxane leveling agent SP-931, 0.3 part of polyamide wax, 5 parts White carbon black H18, 20 parts of nano-silver powder with a particle diameter of 100nm and 30 parts of micron silver powder with a particle diameter of 1 μm were added to the mixture obtained in step (1) and stirred for 2 hours;

[0064] (3) The mixture obtained in step (2) is ball-milled for 5 hours, and the fineness of the test material is less than 3 μm before collection. After collection, it is filtered with a 400-mesh sieve, and after filtration, it is filled into a syringe for storage. ...

Embodiment 2

[0067] (1) At 25°C, 10 parts of thermoplastic alcohol-soluble acrylic resin B731 with a viscosity of 6000 cps and 35 parts of absolute ethanol were added to the reaction kettle and stirred and mixed for 5 hours;

[0068] (2) Under the condition of 25°C, 1 part of alcohol ether solvent dispersant BYK-P104S, 1 part of water-oil general-purpose polyether modified polysiloxane leveling agent SP-963, 0.1 part of polyamide wax, 5 parts of white carbon black H20, 40 parts of particle diameters are the nanometer silver powder of 150nm and 30 parts of particle diameters are the micron silver powder of 1 μm join in the mixture gained in step (1) and stir and mix for 2 hours;

[0069] (3) The mixture obtained in step (2) is ball-milled for 5 hours, and the fineness of the test material is less than 3 μm before collection. After collection, it is filtered with a 400-mesh sieve, and after filtration, it is filled into a syringe for storage.

[0070] The prepared conductive adhesive was cur...

Embodiment 3

[0072] (1) At 25°C, 15 parts of thermoplastic alcohol-soluble acrylic resin B736 with a viscosity of 4000 cps and 35 parts of absolute ethanol were added to the reaction kettle and stirred and mixed for 5 hours;

[0073] (2) Under the condition of 25°C, 1 part of alcohol ether solvent dispersant BYK-163, 1 part of water-oil general-purpose polyether modified polysiloxane leveling agent SP-983, 0.2 part of polyamide wax, 5 parts of white carbon black H21, 30 parts of nanometer silver powders with a particle diameter of 100nm and 35 parts of micron silver powders with a particle diameter of 1 μm were added to the mixture obtained in step (1) and the time for stirring and mixing was 2 hours;

[0074] (3) The mixture obtained in step (2) is ball-milled for 5 hours, and the fineness of the test material is less than 3 μm before collection. After collection, it is filtered with a 400-mesh sieve, and after filtration, it is filled into a syringe for storage.

[0075] The prepared con...

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Abstract

The invention particularly relates to a normal-temperature cured conductive adhesive and a preparation method thereof. The normal-temperature cured conductive adhesive is prepared by the following method: mixing thermoplastic alcohol-soluble acrylic resin with absolute ethyl alcohol, then continuously adding a dispersing agent, a flatting agent, a thickening and anti-settling agent, white carbon black, nano-silver powder and micron-silver powder, stirring and mixing, ball-milling, filtering and filling. The prepared conductive adhesive is high in curing speed, long in application period and good in adhesion, and can be well used as a conductive adhesive for an electronic device such as an LCD (liquid crystal display) liquid crystal screen and used for conducting static electricity.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a room temperature curing conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive with certain bonding properties after curing. It usually uses conductive fillers and base glue as the main raw materials. Through the bonding of the base glue, the conductive particles are combined to form a conductive path to realize the bonded material. conductive connection. [0003] There are three types of traditional conductive adhesives, epoxy system, silicone system, and organosilicon system. Epoxy systems require the use of a curing agent to achieve curing and film formation. Most epoxy curing agents require heating to undergo crosslinking reactions. The room temperature curing agent has a short latency and the pot life is only a few hours or even a few minutes. Silicone system, although the normal temperature cur...

Claims

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Application Information

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IPC IPC(8): C09J133/04C09J11/08C09J11/04C09J9/02
Inventor 饶龙来赵月郎嘉良赵刚
Owner 北京氦舶科技有限责任公司
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