Integrated die-cast inductor structure with top being coated with conductor and preparation process thereof

Abstract

The invention discloses an integrated die-cast inductor structure with a top being coated with a conductor and a preparation process of the integrated die-cast inductor structure. The preparation process comprises a material preparation step: winding an enameled wire coil in a die-cast inductor body, and enabling the end edge of the enameled wire coil to be exposed out of the die-cast inductor body; a step of insulating paint coating: coating the outer surface of the die-cast inductor body with a layer of insulating paint; an laser engraving step of an outer electrode area: removing the insulating varnish in an outer electrode setting area by using a laser source; a grinding and removing step: further removing the side surface of the die-cast inductor body corresponding to the end edge ofthe enameled wire by utilizing grinding equipment; and a step of electroplating a copper layer, a nickel layer and a tin layer: sequentially plating the copper layer, the nickel layer and the tin layer on the external electrode arrangement area and the grinding and removing area by utilizing an electroplating mode. By means of the mode, the top of the integrated die-cast inductor is covered with the conductive layer, the conductive layer is guided to the bottom to form the electrode, the electrode and the PCB can be grounded, and therefore redundant electromagnetic interference is guided to the grounding end, and interference to a circuit is effectively reduced.

Description

technical field [0001] The invention relates to the field of preparation of an integrally formed die-cast inductor, in particular to an integrally formed die-cast inductor structure with a top-coated conductor and a preparation process thereof. Background technique [0002] Inductance is an important component in the circuit, which can achieve functions such as filtering, energy storage, and resonance. With the increasing miniaturization of electronic products and high-density assembly of components, inductance components have developed rapidly, and under the consideration of electromagnetic compatibility, electronic EMI elimination of products has become an important requirement for electronic products. [0003] The chip-type integrated molded inductor in the prior art includes a coil formed by winding enameled wire in the center, and the coil is surrounded by magnetic metal powder to form an iron core, and then coated with a layer of polymer paint as a protective layer, me...

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Problems solved by technology

[0004] In the above structure, the outermost polymer coating of the magnetic core is only used for weather resistance protection. In actual application, there will be some factors such as circuit design, application conditions, magnetic materials or structural design, which will cause the magnetic field to affect the circuit signal or the surrounding area. Components cause interference. For example, the inductance originally selected by the customer will interfere with the signal under the PCB. At this time, the circuit design and inductance must be readjusted to meet safety regulations, and it is usually necessary to adjust each related component, which is cumbersome. Waste of time and affect customer satisfaction

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