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New purpose of 2,2'- dithiopyridine, electroplating hole filling additive with same and electroplating method adopting additive

A dithiodipyridine, electroplating and hole filling technology, applied in the field of compounds, can solve the problems of low final yield, high investment cost, environmental pollution, etc., achieve strong conductivity and reliability, smooth and dense surface, shorten the process flow Effect

Active Publication Date: 2019-07-05
BOMIN ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the through-hole plating filling and leveling agents on the market are self-synthesized or a mixture of several organic nitrogen-containing macromolecular compounds. The preparation raw materials and synthesis process are complicated, and the final yield is low, and there is a pungent smell. It is extremely toxic to aquatic organisms, pollutes the environment, is generally highly corrosive and its preparation process is complicated, the investment cost is high, and it is easy to mix organic matter, which leads to complex and uncontrollable chemical reactions and then affects its overall plating. liquid stability
For example: Patent CN 103572335 A is a mixture of leveling agent A and leveling agent B; wherein, leveling agent A is polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N-vinylimidazole (moisture absorption , corrosive) and epoxy compound polymers, which are mixtures of macromolecular organic compounds, the synthesis cost is high, and the polymer is prone to degradation in an aerobic environment, and there are complex and uncontrollable chemical reactions that lead to its The stability of the plating solution is poor when it exists for a long time; the leveling agent used in the patent CN 108166030 A is a macromolecular amine compound, such as polyethylene polyamine, polyallylamine, the former has a pungent ammonia smell, and It is very easy to react with moisture and carbon dioxide in the air to absorb moisture, and has a certain degree of corrosion. In particular, this compound is extremely toxic to aquatic organisms and pollutes the water environment. The latter has complex raw materials and conditions, and the synthesis yield is low. thereby increasing the cost

Method used

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  • New purpose of 2,2'- dithiopyridine, electroplating hole filling additive with same and electroplating method adopting additive
  • New purpose of 2,2'- dithiopyridine, electroplating hole filling additive with same and electroplating method adopting additive
  • New purpose of 2,2'- dithiopyridine, electroplating hole filling additive with same and electroplating method adopting additive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 1. Preparation of Test Plates

[0046] Cutting→drilling→cleaning→immersion copper (taking a through-hole plate with a depth-to-diameter ratio of 1.2:1 as an example):

[0047] 2. Specific steps of through-hole plating and filling process:

[0048] (1) Preparation of electroplating solution

[0049] formula:

[0050]

[0051] Preparation method

[0052] Step 1: Weigh copper sulfate in a beaker;

[0053] Step 2: Add deionized water and stir to dissolve;

[0054] Step 3: Measure sulfuric acid and slowly inject it into the copper sulfate solution, stirring and diluting until completely dissolved;

[0055] Step 4: adding chloride ion, accelerator, inhibitor respectively in the dissolved copper sulfate solution;

[0056] Step 5: Add the new leveling agent, stir until the solution is evenly mixed, and cool to room temperature for use.

[0057] (2) Sample pre-treatment: degreasing→water washing→acid leaching

[0058] Degreasing: Since the test board will inevitably h...

Embodiment 2

[0065] 1. Preparation of test board:

[0066] Cutting → Drilling → Cleaning → Immersion Copper (Taking a through-hole plate with a depth-to-diameter ratio of 1.2:1 as an example)

[0067] 2. Specific steps of through-hole plating and filling process:

[0068] (1) Preparation of electroplating solution

[0069] formula:

[0070]

[0071]

[0072] Preparation method is identical with embodiment 1.

[0073] (2) Sample pre-treatment: degreasing→water washing→acid leaching

[0074] Degreasing: Since the test board will inevitably have grease, finger prints and other dirt on the surface during the preparation process, in order to make the pretreatment effect better, degreasing is required to remove organic pollutants on the copper surface, and the degreasing temperature is controlled at 45±5 ℃, the degreasing time is 2-3min;

[0075] Water washing: first wash with a large amount of tap water to ensure that the insoluble substances in the degreasing liquid are washed away,...

Embodiment 3

[0081] 1. Preparation of test board:

[0082] Cutting → Drilling → Cleaning → Immersion Copper (Taking a through-hole plate with a depth-to-diameter ratio of 1.2:1 as an example)

[0083] 2. Specific steps of through-hole plating and filling process:

[0084] (1) Preparation of electroplating solution

[0085] formula:

[0086]

[0087] Preparation method is identical with embodiment 1.

[0088] (2) Sample pre-treatment: degreasing→water washing→acid leaching

[0089] Degreasing: Since the test board will inevitably have grease, finger prints and other dirt on the surface during the preparation process, in order to make the pretreatment effect better, degreasing is required to remove organic pollutants on the copper surface, and the degreasing temperature is controlled at 45±5 ℃, the degreasing time is 2-3min;

[0090] Water washing: first wash with a large amount of tap water to ensure that the insoluble substances in the degreasing liquid are washed away, and then wa...

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Abstract

The invention discloses a new purpose of 2,2'- dithiopyridine, an electroplating hole filling additive with the same and an electroplating method adopting the additive, specifically, the purpose of 2,2'- dithiopyridine serving as the electroplating hole filling leveling agent, and belongs to the technical field of electroplating leveling agent. The additive is composed of 200 to 300 ppm of an inhibitor, 5 to 11 ppm of an accelerating agent and 7 to 15 ppm of 2,2'- dithiopyridine. The application of the 2,2'- dithiopyridine to the electroplating hole filling leveling agent is provided, and the2,2'- dithiopyridine is used for electroplating hole filling of a circuit board.

Description

technical field [0001] The present invention relates to a new application of a compound, more specifically, especially relates to the application of 2,2'-dithiobipyridine as an electroplating hole-filling and leveling agent. The invention also relates to a special additive for hole filling in electroplating using the compound and an electroplating method using the additive. Background technique [0002] With the rapid development of the electronics factory industry, this also promotes the growing of the printed circuit board (Printed Circuit Board, PCB) industry. The printed circuit board is one of the indispensable and important parts of electronic products. It mainly has two functions, that is, the function of supporting circuit components and interconnecting circuit components. Through holes are used to realize high-density electrical interconnection. hole. Nowadays, the traditional through-hole plating generally adopts the plugging method, which is mainly divided into ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38H05K3/42
CPCC25D3/38H05K3/424
Inventor 王旭张胜涛陈世金郭海亮罗佳玉巫萃婷徐缓
Owner BOMIN ELECTRONICS CO LTD
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